Devices including control logic structures, electronic systems, and related methods

ABSTRACT

A semiconductor device includes a stack structure comprising decks. Each deck of the stack structure comprises a memory element level comprising memory elements and control logic level in electrical communication with the memory element level, the control logic level comprising a first subdeck structure comprising a first number of transistors comprising a P-type channel region or an N-type channel region and a second subdeck structure comprising a second number of transistors comprising the other of the P-type channel region or the N-type channel region overlying the first subdeck structure. Related semiconductor devices and methods of forming the semiconductor devices are disclosed.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.15/858,128, filed Dec. 29, 2017, now U.S. Pat. No. 10,366,983, issuedJul. 30, 2019 the disclosure of which is hereby incorporated herein inits entirety by this reference.

TECHNICAL FIELD

Embodiments of the disclosure relate to the field of semiconductordevice design and fabrication. More particularly, embodiments of thedisclosure relate to control logic devices including stacked decks oftransistors, to control logic assemblies, semiconductor devicesincluding the control logic devices, and to methods of forming thecontrol logic devices and semiconductor devices.

BACKGROUND

Semiconductor device designers often desire to increase the level ofintegration or density of features within a semiconductor device byreducing the dimensions of the individual features and by reducing theseparation distance between neighboring features. In addition,semiconductor device designers often desire to design architectures thatare not only compact, but offer performance advantages, as well assimplified designs.

One example of a semiconductor device is a memory device. Memory devicesare generally provided as internal integrated circuits in computers orother electronic devices. There are many types of memory including, butnot limited to, random-access memory (RAM), read only memory (ROM),dynamic random access memory (DRAM), synchronous dynamic random accessmemory (SDRAM), flash memory, and resistance variable memory.Nonlimiting examples of resistance variable memory include resistiverandom access memory (ReRAM), conductive bridge random access memory(conductive bridge RAM), magnetic random access memory (MRAM), phasechange material (PCM) memory, phase change random access memory (PCRAM),spin-torque-transfer random access memory (STTRAM), oxygen vacancy-basedmemory, and programmable conductor memory.

A typical memory cell of a memory device includes one access device,such as a transistor, and one memory storage structure, such as acapacitor. Modern applications for semiconductor devices can employsignificant quantities of memory cells, arranged in memory arraysexhibiting rows and columns of the memory cells. The memory cells may beelectrically accessed through digit lines (e.g., bit lines) and wordlines (e.g., access lines) arranged along the rows and columns of thememory cells of the memory arrays. Memory arrays can be two-dimensional(2D) so as to exhibit a single deck (e.g., a single tier, a singlelevel) of the memory cells, or can be three-dimensional (3D) so as toexhibit multiple decks (e.g., multiple levels, multiple tiers) of thememory cells.

Control logic devices within a base control logic structure underlying amemory array of a memory device have been used to control operations(e.g., access operations, read operations, write operations) on thememory cells of the memory device. An assembly of the control logicdevices may be provided in electrical communication with the memorycells of the memory array by way of routing and interconnect structures.However, as the number of memory cells and a corresponding number ofdecks of a 3D memory array increases, electrically connecting the memorycells of the different decks of the 3D memory array to the assembly ofcontrol logic devices within the base control logic structure locatedbelow the memory array can create sizing and spacing complicationsassociated with the increased quantities and dimensions of routing andinterconnect structures required to facilitate the electricalconnection. In addition, the quantities, dimensions, and arrangements ofthe different control logic devices employed within the base controllogic structure can also undesirably impede reductions to the size of amemory device, increases to the storage density of the memory device,and/or reductions in fabrication costs.

It would, therefore, be desirable to have improved semiconductordevices, control logic assemblies, and control logic devicesfacilitating higher packing densities, as well as methods of forming thesemiconductor devices, control logic assemblies, and control logicdevices.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

FIG. 1 is a simplified side elevation view of a semiconductor device, inaccordance with an embodiment of the disclosure;

FIG. 2 is a simplified block diagram of a thin film transistor (TFT)control logic level of the semiconductor device shown in FIG. 1, inaccordance with embodiments of the disclosure;

FIG. 3A and FIG. 3B are simplified cross-sectional views of a TFTcontrol logic level including metal-oxide-semiconductor (CMOS) circuits,in accordance with embodiments of the disclosure;

FIG. 3C is a perspective view of the CMOS inverter of FIG. 3A and FIG.3B;

FIG. 4 is a simplified perspective view of a two-input negative-AND(NAND) circuit, in accordance with embodiments of the disclosure;

FIG. 5 is a simplified perspective view of a balanced CMOS inverter, inaccordance with embodiments of the disclosure;

FIG. 6 is a simplified perspective view of a CMOS transmission passgate, in accordance with embodiments of the disclosure;

FIG. 7 is a simplified perspective view of a balanced two-input NANDcircuit, in accordance with embodiments of the disclosure;

FIG. 8A is a simplified perspective view of a ring oscillator inaccordance with embodiments of the disclosure;

FIG. 8B is a simplified perspective view of another ring oscillator, inaccordance with other embodiments of the disclosure;

FIG. 9 is a simplified perspective view of a balanced two-input NANDcircuit comprising NMOS transistors and PMOS transistors with a planarchannel region, in accordance with embodiments of the disclosure;

FIG. 10A through FIG. 10Z are simplified partial cross-sectional viewsillustrating a method of forming a semiconductor device including anarray of CMOS inverters, in accordance with embodiments of thedisclosure;

FIG. 11A and FIG. 11B are simplified cross-sectional views of asemiconductor device including a vertical NMOS transistor and a verticalPMOS transistor, in accordance with embodiments of the disclosure;

FIG. 12A and FIG. 12B are simplified cross-sectional views of asemiconductor device including a vertical NMOS transistor and a verticalPMOS transistor, in accordance with other embodiments of the disclosure;and

FIG. 13 is a schematic block diagram of an electronic system, inaccordance with embodiments of the disclosure.

DETAILED DESCRIPTION

The illustrations included herewith are not meant to be actual views ofany particular systems or semiconductor structures, but are merelyidealized representations that are employed to describe embodimentsherein. Elements and features common between figures may retain the samenumerical designation except that, for ease of following thedescription, for the most part, reference numerals begin with the numberof the drawing on which the elements are introduced or most fullydescribed.

The following description provides specific details, such as materialtypes, material thicknesses, and processing conditions in order toprovide a thorough description of embodiments described herein. However,a person of ordinary skill in the art will understand that theembodiments disclosed herein may be practiced without employing thesespecific details. Indeed, the embodiments may be practiced inconjunction with conventional fabrication techniques employed in thesemiconductor industry. In addition, the description provided hereindoes not form a complete description of a semiconductor device, a thinfilm transistor control logic structure, or a complete description of aprocess flow for manufacturing such semiconductor devices or controllogic structures. Only those process acts and structures necessary tounderstand the embodiments described herein are described in detailbelow. Additional acts to form a complete semiconductor device orcontrol logic structure including the structures described herein may beperformed by conventional techniques.

According to embodiments disclosed herein, a semiconductor devicecomprises a multi-deck structure including a base control logicstructure and a stack structure over the base control logic structure.The stack structure includes decks, each deck comprising a memoryelement level, an access device level, and a thin film transistor (TFT)control logic level (e.g., a control logic level including one or morefield-effect transistors including films of active semiconductormaterials, dielectric materials, and metallic contacts). The TFT controllogic level comprises, in some embodiments, a TFT CMOS device andincludes a first subdeck structure comprising one of NMOS transistorsand PMOS transistors and a second subdeck structure over the firstsubdeck structure and comprising the other of the NMOS transistors andthe PMOS transistors. The first subdeck structure and the second subdeckstructure may be vertically displaced from each other. The NMOStransistors, the PMOS transistors, or both may comprise a verticallyextending channel region extending in a direction substantiallyorthogonal to the base control logic structure. In other embodiments,the NMOS transistors, the PMOS transistors, or both may comprise alaterally extending channel region, and may comprise planar transistors.

Arranging the semiconductor device to include the decks, each deckincluding a TFT control logic level, may reduce interconnect circuitrybetween each deck and the base control logic structure and any accessdevice levels and memory element levels associated with each deck.Accordingly, the thin film transistor control logic levels may be formedto comprise CMOS circuitry with a reduced number (e.g., none) of socketsor interconnects down to the base control logic structure between thememory elements and access devices of each deck and the base controllogic structure. In addition, since the subdeck structures arevertically displaced, the NMOS transistors and the PMOS transistors maybe formed separately and associated with a particular deck having itsown memory element level and access device level.

As used herein, the terms “longitudinal,” “vertical,” “lateral,” and“horizontal” are in reference to a major plane of a substrate (e.g.,base material, base structure, base construction, etc.) in or on whichone or more structures and/or features are formed and are notnecessarily defined by earth's gravitational field. A “lateral” or“horizontal” direction is a direction that is substantially parallel tothe major plane of the substrate, while a “longitudinal” or “vertical”direction is a direction that is substantially perpendicular to themajor plane of the substrate. The major plane of the substrate isdefined by a surface of the substrate having a relatively large areacompared to other surfaces of the substrate.

As used herein, spatially relative terms, such as “beneath,” “below,”“lower,” “bottom,” “above,” “upper,” “top,” “front,” “rear,” “left,”“right,” and the like, may be used for ease of description to describeone element's or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. Unless otherwise specified,the spatially relative terms are intended to encompass differentorientations of the materials in addition to the orientation depicted inthe figures. For example, if materials in the figures are inverted,elements described as “below” or “beneath” or “under” or “on bottom of”other elements or features would then be oriented “above” or “on top of”the other elements or features. Thus, the term “below” can encompassboth an orientation of above and below, depending on the context inwhich the term is used, which will be evident to one of ordinary skillin the art. The materials may be otherwise oriented (e.g., rotated 90degrees, inverted, flipped, etc.) and the spatially relative descriptorsused herein interpreted accordingly.

As used herein, the term “substantially” in reference to a givenparameter, property, or condition means and includes to a degree thatone of ordinary skill in the art would understand that the givenparameter, property, or condition is met with a degree of variance, suchas within acceptable manufacturing tolerances. By way of example,depending on the particular parameter, property, or condition that issubstantially met, the parameter, property, or condition may be at least90.0% met, at least 95.0% met, at least 99.0% met, at least 99.9% met,or even 100.0% met.

As used herein, the term “about” in reference to a given parameter isinclusive of the stated value and has the meaning dictated by thecontext (e.g., it includes the degree of error associated withmeasurement of the given parameter).

As used herein, the term “NMOS” transistor means and includes aso-called metal-oxide transistor having a P-type channel region. Thegate of the NMOS transistor may comprise a conductive metal, anotherconductive material, such as polysilicon, or a combination thereof. Asused herein, the term “PMOS” transistor means and includes a so-calledmetal-oxide transistor having an N-type channel region. The gate of thePMOS transistor may comprise a conductive metal, another conductivematerial, such as polysilicon, or a combination thereof. Accordingly,the gate structures of such transistors may include conductive materialsthat are not necessarily metals.

FIG. 1 shows a simplified side elevation view of a semiconductor device100 (e.g., a 3D memory device), in accordance with embodiments of thedisclosure. As shown in FIG. 1, the semiconductor device 100 includes abase control logic structure 102 and a stack structure 103 overlyingwith the base control logic structure 102. As described in furtherdetail below, the stack structure 103 includes decks 104 (e.g., tiers)each individually including a thin film transistor (TFT) control logiclevel, an access device level over the TFT control logic level, a memoryelement level over the access device level, and interconnect structuresextending between the TFT control logic level and each of the accessdevice level and the memory element level. Each TFT control logic levelof the decks 104 may individually include one or more control logicdevices (e.g., TFT CMOS devices) exhibiting subdecks (e.g., sublevels)of transistors (e.g., NMOS transistors, PMOS transistors) thereof, asalso described in further detail below. The base control logic structure102 is in electrical communication with one or more (e.g., each) of thedecks 104 of the stack structure 103 by way of interconnect structures112 extending between the base control logic structure 102 and one ormore levels (e.g., the TFT control logic level) of the one or more decks104 of the stack structure 103.

The base control logic structure 102 may include devices and circuitryfor controlling various operations of the stack structure 103. Thedevices and circuitry included in the base control logic structure 102may be selected relative to devices and circuitry included in the TFTcontrol logic levels of the decks 104 of the stack structure 103. Thedevices and circuitry included in the base control logic structure 102may be different than the devices and circuitry included in the TFTcontrol logic levels of the decks 104 of the stack structure 103, andmay be used and shared by different decks 104 of the stack structure 103to facilitate desired operation of the stack structure 103. By way ofnon-limiting example, the base control logic structure 102 may includeone or more (e.g., each) of charge pumps (e.g., V_(CCP) charge pumps,V_(NEGWL) charge pumps, DVC2 charge pumps), delay-locked loop (DLL)circuitry (e.g., ring oscillators), drain supply voltage (V_(DD))regulators, and various chip/deck control circuitry. The devices andcircuitry included in the base control logic structure 102 may employdifferent conventional CMOS devices (e.g., conventional CMOS inverters,conventional CMOS NAND gates, conventional CMOS transmission pass gates,etc.), which are not described in detail herein. In turn, as describedin further detail below, the devices and circuitry included in the TFTcontrol logic level of each of the decks 104 of the stack structure 103may not be shared by different decks 104 of the stack structure 103, andmay be dedicated to effectuating and controlling various operations(e.g., access device level operations, and memory element leveloperations) of the deck 104 associated therewith not encompassed withinthe functions of the devices and circuitry included in the base controllogic structure 102.

With continued reference to FIG. 1, the stack structure 103 may includeany desired number of the decks 104. For clarity and ease ofunderstanding of the drawings and related description, FIG. 1 shows thestack structure 103 as including three (3) decks 104. A first deck 106may include a first TFT control logic level 106A, a first access devicelevel 106B on or over the first TFT control logic level 106A, a firstmemory element level 106C on or over the first access device level 106B,and first interconnect structures 106D extending between andelectrically coupling the first TFT control logic level 106A to each ofthe first access device level 106B and the first memory element level106C. A second deck 108 may overlie the first deck 106 and may include asecond TFT control logic level 108A, a second access device level 108Bon or over the second TFT control logic level 108A, a second memoryelement level 108C on or over the second access device level 108B, andsecond interconnect structures 108D extending between and electricallycoupling the second TFT control logic level 108A to each of the secondaccess device level 108B and the second memory element level 108C. Athird deck 110 may overlie the second deck 108 and may include a thirdTFT control logic level 110A, a third access device level 110B on orover the third TFT control logic level 110A, a third memory elementlevel 110C on or over the third access device level 110B, and thirdinterconnect structures 110D extending between and electrically couplingthe third TFT control logic level 110A to each of the third accessdevice level 110B and the third memory element level 110C. In additionalembodiments, the stack structure 103 includes a different number ofdecks 104. For example, the stack structure 103 may include greater thantwo (2) decks 104 (e.g., greater than or equal to two (2) decks 104,greater than or equal to four (4) decks 104, greater than or equal toeight (8) decks 104, greater than or equal to sixteen (16) decks 104,greater than or equal to thirty-two (32) decks, greater than or equal tosixty-four (64) decks 104), or may include less than three (3) decks 104(e.g., less than or equal to two (2) decks 104).

Although FIG. 1 illustrates that each of the first deck 106, the seconddeck 108, and the third deck 110 include the respective TFT controllogic level 106A, 108A, 110A below the respective access device levels106B, 108B, 110B and the respective memory element levels 106C, 108C,110C, the disclosure is not so limited. In other embodiments, the TFTcontrol logic level 106A, 108A, 110A of at least one of the first deck106, the second deck 108, and the third deck 110 may be located aboveeach of the respective access device levels 106B, 108B, 110B and therespective memory element levels 106C, 108C, 110C, or between respectiveones of the access device levels 106B, 108B, 110B and the memory elementlevels 106C, 108C, 110C.

The memory element levels (e.g., the first memory element level 106C,the second memory element level 108C, the third memory element level110C) of the each of the decks 104 (e.g., the first deck 106, the seconddeck 108, the third deck 110) of the stack structure 103 may eachindividually include an array of memory elements. The array may, forexample, include rows of the memory elements extending in a firstlateral direction, and columns of the memory elements extending in asecond lateral direction perpendicular to the first lateral direction.In other embodiments, the rows of memory elements and the columns of thememory elements may not be perpendicular to each other. By way ofnonlimiting example, the rows of the memory elements and the columns ofthe memory elements may be arranged in a hexagonal close-packedorientation for increasing a density of the memory elements (e.g., thememory cells).

The memory elements of the array may comprise RAM elements, ROMelements, DRAM elements, SDRAM elements, flash memory elements,resistance variable memory elements, or another type of memory element.In some embodiments, the memory elements comprise DRAM elements. Inadditional embodiments, the memory elements comprise resistance variablememory elements. Nonlimiting examples of resistance variable memoryelements include ReRAM elements, conductive bridge RAM elements, MRAMelements, PCM memory elements, PCRAM elements, STTRAM elements, oxygenvacancy-based memory elements, and programmable conductor memoryelements.

The access device levels (e.g., the first access device level 106B, thesecond access device level 108B, the third access device level 110B) ofeach of the decks 104 (e.g., the first deck 106, the second deck 108,the third deck 110) of the stack structure 103 may each individuallyinclude an array of access devices (e.g., TFT access devices). Theaccess devices of the access device level (e.g., the first access devicelevel 106B, the second access device level 108B, the third access devicelevel 110B) of a given deck 104 (e.g., the first deck 106, the seconddeck 108, the third deck 110) may be operatively associated with thememory elements of the memory element level (e.g., the first memoryelement level 106C, the second memory element level 108C, the thirdmemory element level 110C) of the given deck 104. The quantity andlateral positioning of the access devices of the access device level ofthe given deck 104 may, for example, correspond to the quantity andlateral positioning of the memory elements of the memory element levelof the given deck 104. The access devices of the access device level mayunderlie and be in electrical communication with the memory elements ofthe memory element level. Although FIG. 1 illustrates that the accessdevice levels 106B, 108B, 110B underlie the memory element levels 106C,108C, 110C, the disclosure is not so limited. In other embodiments, theaccess device levels 106B, 108B, 110B may overlie the memory elementlevels 106C, 108C, 110C. Similarly, the access device levels 106B, 108B,110B may overlie the TFT control logic levels 106A, 108A, 110A.

Together the access devices of the access device level and the memoryelements of the memory element level operatively associated therewithmay form memory cells for each of the decks 104 of the stack structure103. The access devices may, for example, each individually include achannel region between a pair of source/drain regions, and a gateconfigured to electrically connect the source/drain regions to oneanother through the channel region. The access devices may compriseplanar access devices (e.g., planar TFT access devices) or verticalaccess devices (e.g., vertical TFT access devices). Planar accessdevices can be distinguished from vertical access devices based upon thedirection of current flow between the source and drain regions thereof.Current flow between the source and drain regions of a vertical accessdevice is primarily substantially orthogonal (e.g., perpendicular) to aprimary (e.g., major) surface of a substrate or base (e.g., the basecontrol logic structure 102) thereunder, and current flow between sourceand drain regions of a planar access device is primarily parallel to theprimary surface of the substrate or base thereunder.

The TFT control logic levels (e.g., the first TFT control logic level106A, the second TFT control logic level 108A, the third TFT controllogic level 110A) of the each of the decks 104 (e.g., the first deck106, the second deck 108, the third deck 110) of the stack structure 103may include devices and circuitry for controlling various operations ofthe memory element level (e.g., the first memory element level 106C, thesecond memory element level 108C, the third memory element level 110C)and the access device level (e.g., the first access device level 106B,the second access device level 108B, the third access device level 110B)of the deck 104 not encompassed (e.g., effectuated, carried out,covered) by the devices and circuitry of the base control logicstructure 102. By way of non-limiting example, the TFT control logiclevels may each individually include one or more (e.g., each) ofdecoders (e.g., local deck decoders, column decoders, row decoders),sense amplifiers (e.g., equalization (EQ) amplifiers, isolation (ISO)amplifiers, NMOS sense amplifiers (NSAs), PMOS sense amplifiers (PSAs)),word line (WL) drivers, repair circuitry (e.g., column repair circuitry,row repair circuitry), I/O devices (e.g., local I/O devices), testdevices, array multiplexers (MUX), error checking and correction (ECC)devices, and self-refresh/wear leveling devices. As described in furtherdetail below, the devices and circuitry included in the TFT controllogic levels may employ TFT CMOS devices (e.g., CMOS inverters, CMOSNAND gates (e.g., a two-input NAND circuit), CMOS pass gates (e.g., CMOStransmission pass gates), etc.) including vertically stacked (e.g.,displaced) PMOS and NMOS transistors. By way of nonlimiting example, thedevices and circuitry of each of the TFT control logic levels maycomprise a first subdeck structure comprising one of NMOS transistorsand PMOS transistors (e.g., an array of NMOS transistors or PMOStransistors) and a second subdeck structure over the first subdeckstructure and comprising the other of the NMOS transistors and the PMOStransistors (e.g., an array of the other of NMOS transistors and PMOStransistors). At least some of the transistors of the first subdeckstructure may be in electrical communication with at least some of thetransistors of the second subdeck structure to form one or more TFT CMOSdevices (including one or more CMOS circuits).

The devices and circuitry of the TFT control logic level of each of thedecks 104 may only be utilized to effectuate and control operationswithin a single (e.g., only one) deck 104 of the stack structure 103(e.g., may not be shared between two or more of the decks 104), or maybe utilized to effectuate and control operations within multiple (e.g.,more than one) decks 104 of the stack structure 103 (e.g., may be sharedbetween two or more of the decks 104). In addition, each of the TFTcontrol logic levels (e.g., the first TFT control logic level 106A, thesecond TFT control logic level 108A, and the third TFT control logiclevel 110A) of the stack structure 103 may exhibit substantially thesame configuration (e.g., substantially the components and componentarrangements), or at least one of the TFT control logic levels of thestack structure 103 may exhibit a different configuration (e.g.,different components and/or a different component arrangement) than atleast one other of the TFT control logic levels.

Thus, a semiconductor device according to embodiments of the disclosurecomprises a base control logic structure comprising control logicdevices, and a stack structure in electrical communication with the basecontrol logic structure. The stack structure comprises stacked deckseach deck of the stacked decks individually comprising a memory elementlevel comprising memory elements, an access device level comprisingaccess devices electrically connected to the memory elements of thememory element level, and a control logic level in electricalcommunication with the memory element level and the access device leveland comprising additional control logic devices. At least one of theadditional control logic devices of the control logic level of one ormore of the decks of the stacked decks comprises a CMOS devicecomprising a first number of transistors comprising one of N-typechannel regions or P-type channel regions disposed over a second numberof transistors comprising the other of the N-type channel regions andthe P-type channel regions. The TFT control logic level may further bein electrical communication with the base control logic structure.

FIG. 2 is a block diagram of a configuration of a TFT control logiclevel 200 for use in one or more of the decks 104 (FIG. 1) of the stackstructure 103 (FIG. 1) of the semiconductor device 100 shown in FIG. 1,The TFT control logic level 200 may include a variety of control logicdevices and circuits that would otherwise be included in off-deckcircuitry (e.g., circuitry not presented within the TFT control logiclevel 200), such as circuitry within a base control logic structure(e.g., the base control logic structure 102 shown in FIG. 1). Forexample, as shown in FIG. 2, an assembly of control logic devices andcircuits present within the TFT control logic level 200 may include oneor more (e.g., each) of a local deck decoder 202, multiplexers (MUX) 204(illustrated in FIG. 2 as a first MUX 204 a, a second MUX 204 b, and athird MUX 204 c), a column decoder 206, a row decoder 208, senseamplifiers 210, local I/O devices 212, WL drivers 214, a column repairdevice 216, a row repair device 218, a memory test device 222, an ECCdevice 220, and a self-refresh/wear leveling device 224. The assembly ofcontrol logic devices and circuits present within the TFT control logiclevel 200 may be operatively associated with (e.g., in electricalcommunication with) additional control logic devices and circuitsoutside of the TFT control logic level 200 (e.g., within one or moreadditional levels and/or structures, such the base control logicstructure 102 shown in FIG. 1), such as a deck enable signal 226, globaldata signal 228, row address signal 230, column address signal 232,global clock devices 234, and other off-deck devices 236 (e.g., acontroller, a host). While FIG. 2 depicts a particular configuration ofthe TFT control logic level 200, one of ordinary skill in the art willappreciate that different control logic assembly configurations,including different control logic devices and circuits and/or differentarrangements of control logic devices and circuits, are known in the artwhich may be adapted to be employed in embodiments of the disclosure.FIG. 2 illustrates just one non-limiting example of the TFT controllogic level 200.

As shown in FIG. 2, one or more off-deck devices 236 located outside ofthe TFT control logic level 200 (e.g., in the base control logicstructure 102 shown in FIG. 1) may be configured and operated to conveysignals (e.g., a deck enable signal 226, a row address signal 230, acolumn address signal 232) to different devices of the TFT control logiclevel 200. For example, the off-deck devices 236 may send a deck enablesignal 226 to the local deck decoder 202, which may decode the deckenable signal 226 and activate one or more of the MUX 204 (e.g., thefirst MUX 204 a, the second MUX 204 b, and/or the third MUX 204 c) ofthe TFT control logic level 200. As described in further detail below,when activated, the MUX 204 may individually be configured and operatedto select one of several input signals and then forward the selectedinput into a single line.

The first MUX 204 a (e.g., a row MUX) of the TFT control logic level 200may be in electrical communication with the local deck decoder 202 andthe row decoder 208 of the TFT control logic level 200. The first MUX204 a may be activated by signal(s) from the local deck decoder 202, andmay be configured and operated to selectively forward at least one rowaddress signal 230 from the off-deck devices 236 to the row decoder 208.The row decoder 208 may be configured and operated to select particularword lines of a deck (e.g., one of the first deck 106, the second deck108, and the third deck 110 shown in FIG. 1) including the TFT controllogic level 200 based on the row address signal 230 received thereby.

With continued reference to FIG. 2, the row repair device 218 of the TFTcontrol logic level 200 may be in electrical communication with the rowdecoder 208, and may be configured and operated to substitute adefective row of memory elements of a memory element array of a memoryelement level (e.g., one of the memory element levels 106C, 108C, 110Cshown in FIG. 1) operatively associated with (e.g., within the same deck104 shown in FIG. 1) the TFT control logic level 200 for a spare,non-defective row of memory elements of the memory element array of thememory element level. The row repair device 218 may transform a rowaddress signal 230 directed to the row decoder 208 (e.g., from the firstMUX 204 a) identifying the defective row of memory elements into anotherrow address signal identifying the spare, non-defective row of memoryelements. Defective rows (and columns) of memory elements may, forexample, be determined using the memory test device 222 of the TFTcontrol logic level 200, as described in further detail below.

The WL drivers 214 of the TFT control logic level 200 may be inelectrical communication with the row decoder 208, and may be configuredand operated to activate word lines of a deck (e.g., one of the firstdeck 106, the second deck 108, and the third deck 110 shown in FIG. 1)including the TFT control logic level 200 based on word line selectioncommands received from the row decoder 208. The memory elements of amemory element level (e.g., one of the memory element levels 106C, 108C,110C shown in FIG. 1) operatively associated with the TFT control logiclevel 200 may be accessed by way of access devices of an access devicelevel (e.g., one of the access device levels 106B, 108B, 110B shown inFIG. 1) operatively associated with the TFT control logic level 200 forreading or programming by voltages placed on the word lines using the WLdrivers 214.

The self-refresh/wear leveling device 224 of the TFT control logic level200 may be in electrical communication with the row decoder 208, and maybe configured and operated to periodically recharge the data stored inmemory elements of a memory element level (e.g., one of the memoryelement levels 106C, 108C, 110C shown in FIG. 1) operatively associatedwith (e.g., within the same deck 104 shown in FIG. 1) the TFT controllogic level 200. During a self-refresh/wear leveling operation, theself-refresh/wear leveling device 224 may be activated in response to anexternal command signal, and may generate different row address signalsthat may be forwarded to the row decoder 208. The row decoder 208 maythen select particular word lines of a deck (e.g., one of the first deck106, the second deck 108, and the third deck 110 shown in FIG. 1)including the TFT control logic level 200 based on the different rowaddress signals received from the self-refresh/wear leveling device 224.The row decoder 208 may then communicate with the WL drivers 214 toactivate the selected word lines, and charges accumulated in capacitorsof memory elements operatively associated with the selected word linesmay then be amplified by a sense amplifier and then stored in thecapacitors again.

Still referring to FIG. 2, the second MUX 204 b (e.g., a column MUX) ofthe TFT control logic level 200 may be in electrical communication withthe local deck decoder 202 and the column decoder 206 of the TFT controllogic level 200. The second MUX 204 b may be activated by signal(s) fromthe local deck decoder 202, and may be configured and operated toselectively forward at least one column address signal 232 from theoff-deck devices 236 to the column decoder 206. The column decoder 206may be configured and operated to select particular digit lines (e.g.,bit lines) of a deck (e.g., one of the first deck 106, the second deck108, and the third deck 110 shown in FIG. 1) including the TFT controllogic level 200 based on the column address selection signal receivedthereby.

The column repair device 216 of the TFT control logic level 200 may bein electrical communication with the column decoder 206, and may beconfigured and operated to substitute a defective column of memoryelements of a memory element array of a memory element level (e.g., oneof the memory element levels 106C, 108C, 110C shown in FIG. 1)operatively associated with (e.g., within the same deck 104 shown inFIG. 1) the TFT control logic level 200 for a spare, non-defectivecolumn of memory elements of the memory element array of the memoryelement level. The column repair device 216 may transform a columnaddress signal 232 directed to the column decoder 206 (e.g., from thesecond MUX 204 b) identifying the defective column of memory elementsinto another column address signal identifying the spare, non-defectivecolumn of memory elements. As previously discussed, defective columns(and rows) of memory elements may, for example, be determined using thememory test device 222 of the TFT control logic level 200, as describedin further detail below.

The ECC device 220 of the TFT control logic level 200 may be configuredand operated to generate an ECC code (also known as “check bits”). TheECC code may correspond to a particular data value, and may be storedalong with the data value in a memory element of a memory element level(e.g., one of the memory element levels 106C, 108C, 110C shown inFIG. 1) operatively associated with (e.g., within the same deck 104shown in FIG. 1) the TFT control logic level 200. When the data value isread back from the memory element, another ECC code is generated andcompared with the previously-generated ECC code to access the memoryelement. If non-zero, the difference in the previously-generated ECCcode and the newly-generated ECC code indicates that an error hasoccurred. If an error condition is detected, the ECC device 220 may thenbe utilized to correct the erroneous data.

The memory test device 222 of the TFT control logic level 200 may beconfigured and operated to identify defective (e.g., faulty) memoryelements of a memory element array of a memory element level (e.g., oneof the memory element levels 106C, 108C, 110C shown in FIG. 1)operatively associated with (e.g., within the same deck 104 shown inFIG. 1) the TFT control logic level 200. The memory test device 222 mayattempt to access and write test data to memory elements at differentaddresses (e.g., different column addresses, different row addresses)within the memory element array. The memory test device 222 may thenattempt to read data stored at the memory elements, and compare the readdata to the test data expected at the memory elements. If the read datais different than the expected test data, the memory test device 222 mayidentify the memory elements as defective. The defective memory elements(e.g., defective rows of memory elements, defective columns of memoryelements) identified by the memory test device 222 may then be actedupon and/or avoided by other components (e.g., the row repair device218, the column repair device 216) of the TFT control logic level 200.

With continued reference to FIG. 2, the local I/O devices 212 of the TFTcontrol logic level 200 may be configured and operated to receive datafrom digit lines selected by the column decoder 206 during readoperations, and to output data to digit lines selected by the columndecoder 206 during write operations. As shown in FIG. 2, the local I/Odevices 212 may include sense amplifiers 210 configured and operated toreceive digit line inputs from the digit lines selected by the columndecoder 206 and to generate digital data values during read operations.During write operations, the local I/O devices 212 may program data intomemory elements of a memory element level operatively associated withthe TFT control logic level 200 by placing proper voltages on the digitlines selected by the column decoder 206. For binary operation, onevoltage level is typically placed on a digit line to represent a binary“1” and another voltage level to represent a binary “0.”

The third MUX 204 c of the TFT control logic level 200 may be inelectrical communication with the local I/O devices 212 and the localdeck decoder 202. The third MUX 204 c may be activated by signal(s)received from the local deck decoder 202, and may be configured andoperated to receive digital data values generated by the local I/Odevices 212 and to generate a global data signal 228 therefrom. Theglobal data signal 228 may be forwarded to one or more off-deck devices236 (e.g., a controller).

In accordance with embodiments of the disclosure, one or more of thecomponents (e.g., one or more of the local deck decoder 202, the MUX 204(the first MUX 204 a, the second MUX 204 b, the third MUX 204 c), thecolumn decoder 206, the row decoder 208, the sense amplifiers 210, thelocal I/O devices 212, the WL drivers 214, the column repair device 216,the row repair device 218, the ECC device 220, the memory test device222, the self-refresh/wear leveling device 224) of the TFT control logiclevel 200 may employ one or more TFT CMOS devices exhibiting one of PMOStransistors and NMOS transistors over the other of the PMOS transistorsand the NMOS transistors. In other words, the PMOS transistors may bevertically displaced (e.g., located above or located below) from theNMOS transistors. For example, a first subdeck structure may includePMOS transistors arranged in a pattern, group, arrangement, array, etc.and may overlie a second subdeck structure including NMOS transistorsarranged in a pattern, group, arrangement, array, etc. The PMOStransistors may be vertical PMOS transistors having a verticallyoriented (e.g., in a direction perpendicular to a major surface of asubstrate (e.g., the base control logic structure 102) on which thefirst subdeck is formed) channel region. In other embodiments, the PMOStransistors may be planar PMOS transistors having a laterally orientedchannel region. The NMOS transistors may be vertical NMOS transistors,planar NMOS transistors, or a combination thereof.

Accordingly, one or more components of at least one of the TFT controllogic levels (e.g., the first TFT control logic level 106A, the secondTFT control logic level 108A, the third TFT control logic level 110A) ofone or more of the decks 104 (e.g., the first deck 106, the second deck108, the third deck 110) of the stack structure 103 of the semiconductordevice 100 previously described with reference to FIG. 1 may include oneor more TFT CMOS devices comprising a first subdeck structure of one ofPMOS transistors and NMOS transistors over a second subdeck structure ofthe other of the PMOS transistors and the NMOS transistors. Nonlimitingexamples of such TFT CMOS devices are described in further detail belowwith reference to FIG. 3A through FIG. 11B FIG. 11B.

Thus, a TFT control logic assembly according to embodiments of thedisclosure comprises TFT control logic devices selected from the groupcomprising decoders, sense amplifiers, word line drivers, repairdevices, memory test devices, multiplexers, error checking andcorrection devices, and self-refresh/wear leveling devices. At least oneof the TFT control logic devices comprises a first subdeck structurecomprising one of NMOS transistors and PMOS transistors arranged over asecond subdeck structure comprising the other of the NMOS transistorsand the PMOS transistors. The NMOS transistors may each comprise avertically oriented channel region and may be referred to as a verticalNMOS transistor. Similarly, the PMOS transistors may each comprise avertically oriented channel region and may be referred to as a verticalPMOS transistor. In other embodiments, one or both of the NMOStransistors may comprise a laterally extending channel region and may bereferred to as a planar NMOS transistor and each of the PMOS transistorsmay comprise a laterally extending channel region and may be referred toas a planar PMOS transistor. The NMOS transistors and the PMOStransistors may be arranged as bottom gate transistors, top gatetransistors, double gate transistors, gate all around (GAA) transistors,saddle gate transistors, or other transistor structures.

Accordingly, in some embodiments, a method of operating a semiconductordevice comprises controlling functions of a stack structure havingmultiple decks, each deck of the stack structure comprising memory cellsusing control logic levels of the multiple decks, the control logiclevel each comprising at least one control logic device comprising afirst subdeck structure comprising transistors having one of a P-typechannel region and an N-type channel region overlying a second subdeckstructure comprising transistors having the other of the P-type channelregion and the N-type channel region, and controlling additionalfunctions of the stack structure using a base control logic structure inelectrical communication with the control logic levels of the stackstructure.

FIG. 3A is a simplified cross-sectional view of a TFT control logiclevel 300 including TFT CMOS circuits, in accordance with embodiments ofthe disclosure. FIG. 3B is a simplified cross-sectional view of the TFTcontrol logic level taken along section line B-B of FIG. 3A. FIG. 3C isa simplified perspective view of a single CMOS TFT inverter 300′, inaccordance with embodiments of the disclosure. The CMOS TFT inverter300′ may comprise a portion at least one TFT control logic level (e.g.,at least one of the first TFT control logic level 106A, the second TFTcontrol logic level 108A, and the third TFT control logic level 110A).

The TFT control logic level 300 may include vertically stacked subdeckstructures (e.g., levels), such as a first subdeck (e.g., sublevel)structure 301 and a second subdeck (e.g., sublevel) structure 302 overthe first subdeck structure 301 arranged over a substrate 305. Thesubstrate 305 may comprise, for example, one or more of a deck (e.g.,the first deck 106 (FIG. 1), and the base control logic structure 102(FIG. 1)). The first subdeck structure 301 may be in electricalcommunication with the second subdeck structure 302 via an outputstructure 303, as will be described herein. The first subdeck structure301 may include vertical NMOS transistors 310 (e.g., an array ofvertical NMOS transistors 310), each including a semiconductive pillar311 including an N-type source region 310 a, an N-type drain region 310c, and a P-type channel region 310 b between the N-type source region310 a and the N-type drain region 310 c. The N-type source region 310 aand the N-type drain region 310 c of the vertical NMOS transistor 310may each individually be formed of and include at least one N-typeconductivity material. As used herein, an N-type conductivity materialmay include, for example, polysilicon doped with at least one N-typedopant (e.g., arsenic ions, phosphorous ions, antimony ions). The P-typechannel region 310 b of the vertical NMOS transistor 310 may be formedof and include at least one P-type conductivity material. As usedherein, a P-type conductivity material may include, for example,polysilicon doped with at least one P-type dopant (e.g., boron ions).

The second subdeck structure 302 may include vertical PMOS transistors320 (e.g., an array of vertical PMOS transistors), each including asemiconductive pillar 321 including a P-type source region 320 a, aP-type drain region 320 c, and an N-type channel region 320 b betweenthe P-type source region 320 a and the P-type drain region 320 c. TheP-type source region 320 a and the P-type drain region 320 c may includea P-type conductivity material, and may include the same material as theP-type channel region 310 b of the vertical NMOS transistors 310. TheN-type channel region 320 b may include an N-type conductivity materialand may include the same material as one or both of the N-type sourceregion 310 a and the N-type drain region 310 c of the vertical NMOStransistors 310.

The vertical NMOS transistor 310 may exhibit any desired dimensions(e.g., channel width, channel thickness, channel length). By way ofnonlimiting example, in some embodiments, the channel width (extendingin the y-direction) of each of the semiconductive pillars 311 may bewithin a range from about 20 nm to about 200 nm and the channelthickness (extending in the x-direction) of each of the semiconductivepillars 311 may be within a range from about 10 nm to about 50 nm. Insome embodiments, the channel length (extending in the z-direction) maybe within a range from about 50 nm to about 200 nm. Similarly, thevertical PMOS transistors 320 may exhibit any desired dimensions (e.g.,channel width, channel thickness, channel length). By way of nonlimitingexample, in some embodiments, the channel width (extending in they-direction) of each of the semiconductive pillars 311 may be within arange from about 20 nm to about 200 nm and the channel thickness(extending in the x-direction) of each of the semiconductive pillars 311may be within a range from about 10 nm to about 50 nm. In someembodiments, the channel length (extending in the z-direction) is withina range from about 50 nm to about 200 nm. In some embodiments, thedimensions of the vertical NMOS transistors 310 are substantially thesame as the dimensions of the vertical PMOS transistors 320.

In some embodiments, at least one (e.g., each of) the vertical NMOStransistors 310 of the first subdeck structure 301 may be electricallycoupled to and associated with a corresponding vertical PMOS transistor320 through the output structure 303 to form a CMOS circuit (e.g., aCMOS inverter). The vertical PMOS transistor 320 associated with aparticular vertical NMOS transistor 310 may be located directly abovethe particular vertical NMOS transistor 310. However, the disclosure isnot so limited and the vertical PMOS transistor 320 may not be locateddirectly above the associated vertical NMOS transistor 310 and may belaterally offset therefrom.

The vertical NMOS transistors 310 may each include a source contact 312in electrical communication with the N-type source region 310 a. Thesource contact 312 may be in electrical communication with a ground(GND) structure 314.

The vertical NMOS transistors 310 may further include a drain contact316 in electrical communication with the N-type drain region 310 c. Thedrain contact 316 may provide electrical communication between theN-type drain region 310 c and the output structure 303.

In some embodiments, at least some of the vertical NMOS transistors 310may not be in electrical communication with the output structure 303. Insome such embodiments, at least some of the vertical NMOS transistors310 are electrically isolated from the output structure 303 by adielectric material 319. In yet other embodiments, substantially all ofthe vertical NMOS transistors are in electrical communication with theoutput structure 303.

The vertical PMOS transistors 320 may each include a source contact 322in electrical communication with the P-type source region 320 a. Thesource contact 322 may be in electrical communication with a V_(DD)structure (also referred to as a “drain supply voltage” structure) 324.Accordingly, the source contact 322 may provide electrical communicationbetween the P-type source region 320 a and the V_(DD) structure 324.

In some embodiments, at least some of the vertical PMOS transistors 320may not be in electrical communication with the V_(DD) structure 324. Insome such embodiments, at least some of the vertical PMOS transistors320 may be electrically isolated from the V_(DD) structure 324, such asby a dielectric material 348, which may comprise, for example, silicondioxide, silicon nitride, a silicon oxynitride, or combinations thereof.In other embodiments, substantially all of the vertical PMOS transistors320 are in electrical communication with the V_(DD) structure 324.

The vertical PMOS transistors 320 may further include a drain contact326 in electrical communication with the P-type drain region 320 c. Thedrain contact 326 may provide electrical communication between theP-type drain region 320 c and the output structure 303. Accordingly,each of the vertical NMOS transistors 310 may be in electricalcommunication with a corresponding vertical PMOS transistor 320 throughcorresponding drain contacts 316, 326.

With continued reference to FIG. 3A through FIG. 3C, the vertical NMOStransistors 310 may each include a gate dielectric material 317 and agate electrode 318 over the gate dielectric material 317. The gateelectrode 318 is illustrated in FIG. 3B in broken lines to show therelative location of the gate electrode 318, although it is understoodthat the gate electrode 318 would not be in the cross-sectional view ofFIG. 3B. The gate dielectric material 317 of each vertical NMOStransistor 310 may extend over at least sidewalls of the semiconductivepillar 311 (e.g., over sidewalls of the N-type source region 310 a, theP-type channel region 310 b, and the N-type drain region 310 c). In someembodiments, the gate dielectric material 317 extends over the sidewallsof the source contact 312 and the drain contact 316.

The gate dielectric material 317 may include electrically insulativematerials, such as phosphosilicate glass, borosilicate glass,borophosphosilicate glass (BPSG), fluorosilicate glass, silicon dioxide,titanium dioxide, zirconium dioxide, hafnium dioxide, tantalum oxide,magnesium oxide, aluminum oxide, niobium oxide, molybdenum oxide,strontium oxide, barium oxide, yttrium oxide, a nitride material, (e.g.,silicon nitride (Si₃N₄)), an oxynitride (e.g., silicon oxynitride,another gate dielectric material, a dielectric carbon nitride material(e.g., silicon carbon nitride (SiCN)), a dielectric carboxynitridematerial (e.g., silicon carboxynitride (SiOCN)), or combinationsthereof.

The gate electrode 318 may extend over sidewalls of at least the P-typechannel region 310 b and may, in some embodiments, extend over at leasta portion of each of the N-type source region 310 a and the N-type drainregion 310 c. However, the disclosure is not so limited and in otherembodiments, the gate electrode 318 may not extend over sidewalls of theN-type source region 310 a and the N-type drain region 310 c and mayextend over only sidewalls of the P-type channel region 310 b.

The gate electrode 318 may include an electrically conductive material.As used herein, an “electrically conductive material” may refer to oneor more of a metal, such as tungsten, titanium, nickel, platinum,ruthenium, aluminum, copper, molybdenum, gold, a metal alloy, ametal-containing material (e.g., metal nitrides, metal silicides, metalcarbides, metal oxides), a conductively-doped semiconductor material(e.g., conductively-doped silicon, conductively-doped germanium,conductively-doped silicon germanium, etc.), polysilicon, othermaterials exhibiting electrical conductivity, or combinations thereof.Electrically conductive materials may include at least one of titaniumnitride (TiN), tantalum nitride (TaN), tungsten nitride (WN), titaniumaluminum nitride (TiAlN), elemental titanium (Ti), elemental platinum(Pt), elemental rhodium (Rh), elemental ruthenium (Ru), elementalmolybdenum (Mo), elemental iridium (Ir), iridium oxide (IrO_(x)),elemental ruthenium (Ru), ruthenium oxide (RuO_(x)), elemental tungsten(W), elemental aluminum (Al), elemental copper (Cu), elemental gold(Au), elemental silver (Ag), polysilicon, alloys thereof, orcombinations thereof. In some embodiments, the gate electrode 318comprises titanium nitride.

The gate electrode 318 may be formed to exhibit any desired dimensions(e.g., length, width, height). By way of non-limiting example, each gateelectrode 318 may have a width within a range of from about 1 nm toabout 30 nm (e.g., from about 5 nm to about 20 nm, or from about 5 nm toabout 10 nm), and a height within a range of from about 5 nm to about100 nm (e.g., from about 10 nm to about 50 nm, or from about 20 nm toabout 30 nm).

Each of the vertical PMOS transistors 320 may include a gate dielectricmaterial 327 and a gate electrode 328 over the gate dielectric material327. The gate dielectric material 327 of each of the PMOS transistors320 may extend over at least sidewalls of the semiconductive pillar 321(e.g., over sidewalls of the P-type source region 320 a, the N-typechannel region 320 b, and the P-type drain region 320 c). In someembodiments, the gate dielectric material 327 extends over sidewalls ofthe source contact 322 and the drain contact 326. In yet otherembodiments, the gate dielectric material 327 extends over sidewalls ofonly one of the source contact 322 and the drain contact 326.

The gate electrode 328 may extend over sidewalls of at least the N-typechannel region 320 b and may, in some embodiments, extend over at leasta portion of sidewalls of each of the P-type source region 320 a and theP-type drain region 320 c. However, the disclosure is not so limited andin other embodiments, the gate electrode 328 may not extend oversidewalls of the P-type source region 320 a and the P-type drain region320 c.

The gate dielectric material 327 and the gate electrode 328 may includethe same materials described above with reference to the gate dielectricmaterial 317 and the gate electrode 318, respectively. In someembodiments, the gate dielectric material 327 and the gate electrode 328comprise the same material as the gate dielectric material 317 and thegate electrode 318, respectively.

In some embodiments, a gate contact 340 may electrically connect thegate electrode 318 of at least one vertical NMOS transistor 310 to thegate electrode 328 of at least one corresponding vertical PMOStransistor 320. The gate contact 340 may include an electricallyconductive material, such as, for example, titanium, tungsten, copper,aluminum, gold, silver, platinum, rhodium, ruthenium, molybdenum,iridium, titanium nitride, tantalum nitride, titanium aluminum nitride,polysilicon, another conductive material, or combinations thereof. Inother embodiments, at least some of the gate electrodes 318 may beelectrically isolated from the gate contacts 340 by a dielectricmaterial. In some embodiments, at least another gate contact 345comprising an electrically conductive material may be electricallycoupled to the V_(DD) structure 324 and may electrically couple at leastone of the gate electrodes 318, 328 to a word line driver (e.g., theword line driver 214 (FIG. 2)).

Adjacent vertical NMOS transistors 310 may be electrically isolated fromeach other via one or more dielectric materials 343 (FIG. 3A).Similarly, adjacent vertical PMOS transistors 320 may be electricallyisolated from each other by one or more dielectric materials 344 (FIG.3A). The vertical NMOS transistors 310 and the vertical PMOS transistors320 may be isolated from each other by another dielectric material 342.Each of the dielectric materials 342, 343, 344 may comprise anelectrically insulative material, such as, for example, silicon dioxide,silicon nitride, phosphosilicate glass, borosilicate glass,borophosphosilicate glass, another electrically insulative material, orcombinations thereof.

In some embodiments, a liner material 332 may overlie sidewalls of thegate dielectric materials 317, 327 and the gate electrodes 318, 328between adjacent vertical NMOS transistors 310 and adjacent verticalPMOS transistors 320, respectively. The liner material 332 may include,for example, silicon nitride, silicon oxide, a silicon oxynitride, orcombinations thereof.

With reference to FIG. 3B, a liner material 313 may overlie sides of thevertical NMOS transistors 310 and may overlie, for example, sidewalls ofthe source contact 312, the N-type source region 310 a, the P-typechannel region 310 b, the N-type drain region 310 c, and the draincontact 316. In some embodiments, the liner material 313 may overliesidewalls of the GND structure 314 and sidewalls of the output structure303.

Similarly, a liner material 323 may overlie sidewalls of the verticalPMOS transistors 320. The liner material 323 may overlie sidewalls ofthe P-type drain region 320 c, the N-type channel region 320 b, and theP-type source region 320 a. In some embodiments, the liner material 323overlies sidewalls of the source contact 322.

With reference to FIG. 3C, an input structure 334 may be electricallyconnected to at least one of the gate electrode 318 and the gateelectrode 328, such as through a contact structure 336.

Each of the GND structure 314, the V_(DD) structure 324, the outputstructure 303, and the input structure 334 of the TFT control logiclevel 300 may exhibit conventional configurations (e.g., conventionaldimensions, conventional shapes, conventional conductive materialcompositions, conventional material distributions, conventionalorientations, conventional arrangements), which are not described indetail herein. Each of the GND structure 314, V_(DD) structure 324, theoutput structure 303, and the input structure 334 may comprise asuitable electrically conductive material.

Although FIG. 3A through FIG. 3C illustrate that the second subdeckstructure 302 including the vertical PMOS transistors 320 is directlyabove the first subdeck structure 301 including vertical NMOStransistors 310, the disclosure is not so limited. In other embodiments,the first subdeck structure 301 overlies the second subdeck structure302 such that the vertical NMOS transistors 310 overlies vertical PMOStransistors 320. In some such embodiments, a location of the V_(DD)structure 324 and a location of the GND structure 314 may be positionedat suitable locations, as would be understood by one of ordinary skillin the art.

Accordingly, a TFT control logic level of a semiconductor device mayinclude a first subdeck structure of vertical NMOS transistors andvertical PMOS transistors and a second deck structure of the other ofvertical NMOS transistors and vertical PMOS transistors overlying thefirst subdeck structure. The first subdeck structure and the secondsubdeck structure may be arranged to comprise a plurality of CMOScircuits, such as a plurality of CMOS inverters.

FIG. 4 through FIG. 12B are simplified perspective views of additionalTFT CMOS devices according to embodiments of the disclosure that may beincluded in the TFT control logic levels (e.g., the TFT control logiclevel 200 shown in FIG. 2; one or more of the first TFT control logiclevel 106A, the second TFT control logic level 108A, and the third TFTcontrol logic level 110A shown in FIG. 1) of the disclosure. ThroughoutFIG. 4 through FIG. 12B and the written description associatedtherewith, functionally similar features (e.g., structures) are referredto with similar reference numerals incremented by 100. To avoidrepetition, not all features shown in FIG. 4 through FIG. 12B aredescribed in detail herein. Rather, unless described otherwise below,throughout FIG. 4 and FIG. 12B (and the written description associatedtherewith), a feature designated by a reference numeral that is a 100increment of the reference numeral of a previously-described feature(whether the previously-described feature is first described before thepresent paragraph, or is first described after the present paragraph)will be understood to be substantially similar to thepreviously-described feature.

FIG. 4 is a simplified perspective view of a two-input NAND circuit 400,in accordance with embodiments of the disclosure. The two-input NANDcircuit 400 includes a first subdeck structure 401 and a second subdeckstructure 402 overlying the first subdeck structure 401. The two-inputNAND circuit 400 may include a first CMOS circuit 405 including a firstvertical NMOS transistor 410 and a first vertical PMOS transistor 420associated with the first vertical NMOS transistor 410. A second CMOScircuit 415 of the two-input NAND circuit 400 may include a secondvertical NMOS transistor 411 and a second vertical PMOS transistor 421associated with the second vertical NMOS transistor 411.

The first subdeck structure 401 may include the first vertical NMOStransistor 410 and the second vertical NMOS transistor 411. The firstvertical NMOS transistor 410 may include a semiconductive pillarcomprising an N-type source region 410 a, an N-type drain region 410 c,and a P-type channel region 410 b between the N-type source region 410 aand the N-type drain region 410 c. Similarly, the second vertical NMOStransistor 411 may include an N-type source region 411 a, an N-typedrain region 411 c, and a P-type channel region 411 b between the N-typesource region 411 a and the N-type drain region 411 c. Each of theN-type regions and the P-type regions may include the same materialsdescribed above with reference to the respective N-type regions (e.g.,the N-type source region 310 a, the N-type drain region 310 c, and theN-type channel region 320 b) and the P-type regions (e.g., the P-typesource region 320 a, the P-type drain region 320 c, and the P-typechannel region 310 b) described above with reference to FIG. 3A throughFIG. 3C).

The first vertical NMOS transistor 410 may include a gate electrode 418a extending over at least sidewalls of the P-type channel region 410 b.The second vertical NMOS transistor 411 may include a gate electrode 418b extending over at least sidewalls of the P-type channel region 411 b.The gate electrodes 418 a, 418 b may include a conductive material, asdescribed above with reference to the gate electrodes 318, 328 (FIG. 3Athrough FIG. 3C). Although not illustrated in FIG. 4 for clarity, a gatedielectric material may be disposed between the gate electrode 418 a andthe first vertical NMOS transistors 410 and a gate dielectric materialmay be disposed between the gate electrode 418 b and the second verticalNMOS transistor 411.

The second subdeck structure 402 may include the first vertical PMOStransistor 420 and the second vertical PMOS transistor 421. The firstvertical PMOS transistor 420 may include a P-type source region 420 a, aP-type drain region 420 c, and an N-type channel region (not visible inthe view of FIG. 4) between the P-type source region 420 a and theP-type drain region 420 c. Similarly, the second vertical PMOStransistor 421 may include a P-type source region 421 a, a P-type drainregion 421 c, and an N-type channel region (not visible in the view ofFIG. 4) between the P-type source region 421 a and the P-type drainregion 421 c.

The first vertical PMOS transistor 420 may include a gate electrode 428a disposed over at least sidewalls of the N-type channel region thereof.The second vertical PMOS transistor 421 may include a gate electrode 428b disposed over at least sidewalls of the N-type channel region thereof.The gate electrodes 428 a, 428 b may include a conductive material, asdescribed above with reference to the gate electrodes 418 a, 428 b.Although not illustrated in FIG. 4 for clarity, a gate dielectricmaterial may be disposed between the gate electrode 428 a and the firstvertical PMOS transistor 420 and a gate dielectric material may bedisposed between the gate electrode 428 b and the second vertical PMOStransistor 421.

The first vertical NMOS transistor 410 may be electrically connected toa GND structure 414 via a source contact 412. The source contact 412 mayinclude a suitable electrically conductive material for providing anelectrical connection between the GND structure 414 and the N-typesource region 410 a. A drain contact 416 may be in electricalcommunication with the N-type drain region 410 c of the first verticalNMOS transistor 410 to electrically connect the N-type drain region 410c to an electrically conductive interconnect structure 442.

The electrically conductive interconnect structure 442 may be inelectrical communication with a source contact (not shown in the view ofFIG. 4) of the second vertical NMOS transistor 411 to electricallyconnect the N-type source region 411 a of the second vertical NMOStransistor 411 to the electrically conductive interconnect structure 442and the first vertical NMOS transistor 410.

The N-type drain region 411 c of the second vertical NMOS transistor 411may be in electrical communication with the output structure 403 via adrain contact 444. The drain contact 444 may include a suitableelectrically conductive material for providing electrical communicationbetween the N-type drain region 411 c and the output structure 403.

The P-type drain region 420 c and the P-type drain region 421 c of therespective first vertical PMOS transistor 420 and the second verticalPMOS transistor 421 may be in electrical communication with the outputstructure 403 via a respective drain contact 426 and drain contact 446.

The P-type source region 420 a and the P-type source region 421 a of therespective first vertical PMOS transistor 420 and the second verticalPMOS transistor 421 may be in electrical communication with a V_(DD)structure 424 via a respective source contact 448 and source contact450. Each of the source contacts 448, 450 may include a suitableelectrically conductive material for providing an electrical connectionbetween the V_(DD) structure 424 and each of the P-type source region420 a and the P-type source region 421 a.

The gate electrode 428 a of the first vertical PMOS transistor 420 maybe electrically connected to a first input structure 452 via a contactstructure 456. The gate electrode 428 a of the first vertical PMOStransistor 420 may further be in electrical communication with the gateelectrode 418 a of the first vertical NMOS transistor 410 via a gatecontact 440.

The gate electrode 428 b of the second vertical PMOS transistor 421 maybe electrically connected to a second input structure 454 via a contactstructure 458. The gate electrode 428 b may further be in electricalcommunication with the gate electrode 418 b of the second vertical NMOStransistor 411 via a gate contact 457.

The gate contact 440 and the gate contact 457 may comprise suitableelectrically conductive materials for forming electrical connectionsbetween the respective gate electrode 418 a and the gate electrode 428 aand between the gate electrode 418 b and the gate electrode 428 b. Byway of nonlimiting example, the gate contact 440 and the gate contact457 may comprise tungsten, tungsten nitride, titanium, titanium nitride,aluminum, copper, ruthenium, molybdenum, silver, gold, polysilicon,another conductive material, or combinations thereof.

Each of the GND structure 414, the output structure 403, theinterconnect structure 442, the first input structure 452, the secondinput structure 454, and the V_(DD) structure 424 may exhibitconventional configurations (e.g., conventional dimensions, conventionalshapes, conventional conductive material compositions, conventionalmaterial distributions, conventional orientations, conventionalarrangements), which are not described in detail herein, which are notdescribed in detail herein. Each of the GND structure 414, the outputstructure 403, the interconnect structure 442, the first input structure452, the second input structure 454, and the V_(DD) structure 424 maycomprise a suitable electrically conductive material.

Accordingly, the two-input NAND circuit 400 may include a first subdeckstructure 401 including NMOS transistors and a second subdeck structure402 including PMOS transistors disposed over the first subdeck structure401. For example, the two-input NAND circuit 400 may include the firstvertical PMOS transistor 420 and the second vertical PMOS transistor 421over the first vertical NMOS transistor 410 and the second vertical NMOStransistor 411. The first subdeck structure 401 and the second subdeckstructure 402 may include a plurality of two-input NAND circuits 400.Accordingly, in some embodiments, the two-input NAND circuit 400 maycomprise a TFT control logic level 106A, 108A, 110A having a dual deckstructure.

Although FIG. 4 has been described and illustrated as including only asingle two-input NAND circuit 400, the disclosure is not so limited. Itwill be understood that a TFT control logic level may comprise aplurality of two-input NAND circuits 400, wherein the TFT control logiclevel comprises a first subdeck structure of one of NMOS transistors andPMOS transistors and a second subdeck structure of the other of NMOStransistors and PMOS transistors.

FIG. 5 is a simplified perspective view of a balanced CMOS inverter 500,in accordance with embodiments of the disclosure. The balanced CMOSinverter 500 includes a first subdeck structure 501 and a second subdeckstructure 502 overlying the first subdeck structure 501.

As shown in FIG. 5, the balanced CMOS inverter 500 may be similar to theCMOS TFT inverter 300′ previously described with reference to FIG. 3C,except that the balanced CMOS inverter 500 includes a CMOS circuitincluding a single vertical NMOS transistor 510 and multiple (e.g., morethan one) vertical PMOS transistors, such as a first vertical PMOStransistor 520, a second vertical PMOS transistor 550, and a thirdvertical PMOS transistor 560. Multiple vertical PMOS transistors 520,550, 560 may be employed to balance the driving strengths of thedifferent transistors (e.g., the vertical NMOS transistor 510, the firstvertical PMOS transistor 520, the second vertical PMOS transistor 550,and the third vertical PMOS transistor 560) of the CMOS circuit so as tomaximize noise margins and obtain symmetrical characteristics. Asdepicted in FIG. 5, in some embodiments, the CMOS circuit includes asingle (e.g., only one) vertical NMOS transistor 510, and three (3)vertical PMOS transistors. In additional embodiments, the CMOS circuitincludes a different number of vertical PMOS transistors. For example,the CMOS circuit may include a single (e.g., only one) vertical NMOStransistor 510 and two (2) vertical PMOS transistors.

The first subdeck structure 501 includes the vertical NMOS transistor510. The vertical NMOS transistor 510 may include a semiconductivepillar comprising an N-type source region 510 a, an N-type drain region510 c, and a P-type channel region 510 b between the N-type sourceregion 510 a and the N-type drain region 510 c. The N-type source region510 a and the N-type drain region 510 c may include the same materialsdescribed above with reference to the N-type regions (e.g., the N-typesource region 310 a, the N-type drain region 310 c, and the N-typechannel region 320 b) and the P-type channel region 510 b may includethe same material described above with reference to the P-type regions(e.g., the P-type channel region 310 b, the P-type source region 320 a,and the P-type drain region 320 c) with reference to FIG. 3A throughFIG. 3C.

The vertical NMOS transistor 510 may include a gate electrode 518extending over at least sidewalls of the P-type channel region 510 b.The gate electrode 518 may include an electrically conductive material,as described above with reference to the gate electrode 318 (FIG. 3Athrough FIG. 3C). Although not illustrated in FIG. 5 for clarity, a gatedielectric material may be disposed between the gate electrode 518 andthe vertical NMOS transistor 510.

The second subdeck structure 502 may include the first vertical PMOStransistor 520, the second vertical PMOS transistor 550, and the thirdvertical PMOS transistor 560. The first vertical PMOS transistor 520 mayinclude a P-type source region 520 a, a P-type drain region 520 c, andan N-type channel region 520 b between the P-type source region 520 aand the P-type drain region 520 c. Similarly, the second vertical PMOStransistor 550 may include a P-type source region 550 a, a P-type drainregion 550 c, and an N-type channel region 550 b between the P-typesource region 550 a and the P-type drain region 550 c. The thirdvertical PMOS transistor 560 may include a P-type source region 560 a, aP-type drain region 560 c, and an N-type channel region 560 b betweenthe P-type source region 560 a and the P-type drain region 560 c. Eachof the N-type regions and the P-type regions may include the samematerials described above with reference to the N-type regions (e.g.,the N-type source region 310 a, the N-type drain region 310 c, and theN-type channel region 320 b) and the P-type regions (e.g., the P-typesource region 320 a, the P-type drain region 320 c, and the P-typechannel region 310 b) described above with reference to FIG. 3A throughFIG. 3C).

The vertical NMOS transistor 510 may be electrically connected to a GNDstructure 514 via a source contact 512. The source contact 512 mayinclude a suitable electrically conductive material for providing anelectrical connection between the GND structure 514 and the N-typesource region 510 a. A drain contact 516 comprising a suitableelectrically conductive material may be in electrical communication withthe N-type drain region 510 c of the vertical NMOS transistor 510 toelectrically connect the N-type drain region 510 c to an outputstructure 503.

The first vertical PMOS transistor 520 may include a gate electrode 528disposed over at least sidewalls of the N-type channel region 520 bthereof. The second vertical PMOS transistor 550 may include a gateelectrode 558 disposed over at least sidewalls of the N-type channelregion 550 b thereof. The third vertical PMOS transistor 560 may includea gate electrode 568 disposed over at least sidewalls of the N-typechannel region 560 b thereof. The gate electrodes 528, 558, 568 mayinclude an electrically conductive material, as described above withreference to the gate electrode 328 (FIG. 3A through FIG. 3C). Althoughnot illustrated in FIG. 5 for clarity, a gate dielectric material may bedisposed between the gate electrode 528 and the first vertical PMOStransistor 520, a gate dielectric material may be disposed between thegate electrode 558 and the second vertical PMOS transistor 550, and agate dielectric material may be disposed between the gate electrode 568and the third vertical PMOS transistor 560.

The P-type drain region 520 c, 550 c, 560 c of each of the respectivefirst vertical PMOS transistor 520, the second vertical PMOS transistor550, and the third vertical PMOS transistor 560 may be in electricalcommunication with the output structure 503 via a respective draincontact 516, 526, 566, each of which may comprise a suitableelectrically conductive material.

The P-type source regions 520 a, 550 a, 560 a of the respective firstvertical PMOS transistor 520, the second vertical PMOS transistor 550,and the third vertical PMOS transistor 560 may be in electricalcommunication with a V_(DD) structure 524 via a respective sourcecontact 522, 552, 562. Each of the source contacts 522, 552, 562 mayinclude a suitable electrically conductive material for providing anelectrical connection between the V_(DD) structure 524 and each of theP-type source regions 520 a, 550 a, 560 a.

The gate electrode 528 of the first vertical PMOS transistor 520 may beelectrically connected to an input structure 570 via contact structure536. Similarly, the gate electrode 558 of the second vertical PMOStransistor 550 and the gate electrode 568 of the third vertical PMOStransistor 560 may be in electrical communication with the inputstructure 570 via respective contact structures 537, 538. Each of thecontact structures 536, 537, 538 may comprise an electrically conductivematerial.

The gate electrode 528 of the first vertical PMOS transistor 520 may beelectrically connected to the gate electrode 518 of the vertical NMOStransistor 510 via a gate contact 540. Since the gate electrode 528 iselectrically connected to the input structure 570 and the inputstructure 570 is electrically connected to the gate electrodes 558, 556,each of the gate electrodes 558, 568 are also electrically connected tothe gate electrode 518. The gate contact 540 may comprise a suitableelectrically conductive material for establishing electricalcommunication between the gate electrode 518 and the gate electrode 528.By way of nonlimiting example, the gate contact 540 may comprisetungsten, tungsten nitride, titanium, titanium nitride, aluminum,copper, ruthenium, molybdenum, silver, gold, polysilicon, anotherconductive material, or combinations thereof.

Each of the GND structure 514, the output structure 503, the inputstructure 570, and the V_(DD) structure 524 may comprise a suitableelectrically conductive material and may exhibit conventionalconfigurations (e.g., conventional dimensions, conventional shapes,conventional conductive material compositions, conventional materialdistributions, conventional orientations, conventional arrangements),which are not described in detail herein, which are not described indetail herein.

Accordingly, the balanced CMOS inverter 500 includes a vertical NMOStransistor 510 and more than one vertical PMOS transistors 520, 550,560. The vertical NMOS transistor 510 may be located on a separatesubdeck than each of the vertical PMOS transistors 520, 550, 560.

FIG. 6 is a simplified perspective view of a CMOS transmission pass gate600, in accordance with embodiments of the disclosure. The CMOStransmission pass gate 600 includes a CMOS circuit 605, an outputstructure 603, an input structure 624, a first gate input structure 672,and a second gate input structure 670.

The CMOS transmission pass gate 600 may include a first subdeckstructure 601 and a second subdeck structure 602 disposed verticallyover the first subdeck structure 601. The first subdeck structure 601may include a vertical NMOS transistor 610 and the second subdeckstructure 602 may include multiple (e.g., more than one) vertical PMOStransistors, such as a first vertical PMOS transistor 620, a secondvertical PMOS transistor 650, and a third vertical PMOS transistor 660.Accordingly, the CMOS circuit 605 of the CMOS transmission pass gate 600may include the vertical NMOS transistor 610 in the first subdeckstructure 601 and multiple vertical PMOS transistors in the secondsubdeck structure 602.

The multiple vertical PMOS transistors 620, 650, 660 may be employed tobalance the driving strengths of the different transistors (e.g., thevertical NMOS transistor 610, the first vertical PMOS transistor 620,the second vertical PMOS transistor 650, and the third vertical PMOStransistor 660) of the CMOS circuit 605 so as to maximize noise marginsand obtain symmetrical characteristics. Although FIG. 6 illustrates thatthe CMOS circuit 605 includes a single vertical NMOS transistor 610 andthree vertical PMOS transistors, the disclosure is not so limited. Inother embodiments, the CMOS circuit 605 includes a different number ofvertical PMOS transistors, such as, for example, a single vertical PMOStransistor or two vertical PMOS transistors.

The vertical NMOS transistor 610 of the CMOS circuit 605 may include anN-type source region 610 a, an N-type drain region 610 c, and a P-typechannel region (not illustrated in the view of FIG. 6) between theN-type source region 610 a and the N-type drain region 610 c. Inaddition, each of the first vertical PMOS transistor 620, the secondvertical PMOS transistor 650, and the third vertical PMOS transistor 660individually include a P-type source region 620 a, 650 a, 660 a, aP-type drain region 620 c, 650 c, 660 c, and an N-type channel region620 b, 650 b, 660 b between a respective P-type drain region and aP-type source region.

The vertical NMOS transistor 610 may include a gate electrode 618disposed around at least sides of the P-type channel region. The gateelectrode 618 may be in electrical communication with the first gateinput structure 672 via a gate contact 619, which may comprise asuitable electrically conductive material.

The first vertical PMOS transistor 620 may include a gate electrode 628disposed around at least sides of the N-type channel region 620 b, thesecond vertical PMOS transistor 650 may include a gate electrode 658disposed around at least sides of the N-type channel region 650 b, andthe third vertical PMOS transistor 660 may include a gate electrode 668disposed around at least sides of the N-type channel region 660 b. Insome embodiments, each of the gate electrodes 628, 658, 668 arevertically aligned with each other. Each of the gate electrodes 628,658, 668 may be in electrical communication with the second gate inputstructure 670 via a respective gate contact, such as a respective firstgate contact 636, a second gate contact 637, and a third gate contact638, each of which may comprise a suitable electrically conductivematerial.

The input structure 624 may be in electrical communication with each ofthe vertical NMOS transistor 610, the first vertical PMOS transistor620, the second vertical PMOS transistor 650, and the third verticalPMOS transistor 660. By way of nonlimiting example, the input structure624 may include a first portion in electrical communication with thevertical NMOS transistor 610 through an electrically conductive sourcecontact 680. The first portion of the input structure 624 may be inelectrical communication with a second portion of the input structure624 through an electrically conductive contact structure 682. The secondportion may be located in the second subdeck structure 602 and may be inelectrical communication with each of the first vertical PMOS transistor620, the second vertical PMOS transistor 650, and the third verticalPMOS transistor 660 through a respective source contact 622, sourcecontact 652, and source contact 662, each of which may comprise anelectrically conductive material.

The output structure 603 may be in electrical communication with each ofthe vertical NMOS transistor 610, the first vertical PMOS transistor620, the second vertical PMOS transistor 650, and the third verticalPMOS transistor 660. By way of nonlimiting example, the output structure603 may be in electrical communication with the vertical NMOS transistor610 through a drain contact 616. The output structure 603 may inelectrical communication with the first vertical PMOS transistor 620through a drain contact 626, with the second vertical PMOS transistor650 through a drain contact 656, and with the third vertical PMOStransistor 660 through a drain contact 666. Each of the drain contacts616, 626, 656, 666 may comprise an electrically conductive material.

The output structure 603, the input structure 624, the first gate inputstructure 672, and the second gate input structure 670 of the CMOStransmission pass gate 600 may exhibit conventional configurations(e.g., conventional dimensions, conventional shapes, conventionalconductive material compositions, conventional material distributions,conventional orientations, conventional arrangements), which are notdescribed in detail herein. Each of the output structure 603, the inputstructure 624, the first gate input structure 672, and the second gateinput structure 670 may comprise a suitable electrically conductivematerial.

FIG. 7 is a simplified perspective view of a balanced two-input NANDcircuit 700, in accordance with embodiments of the disclosure. Thebalanced two-input NAND circuit 700 includes a CMOS circuit 705, anadditional CMOS circuit 715, a GND structure 714, a V_(DD) structure724, an interconnect structure 707, an output structure 703, a firstinput structure 770, and a second input structure 772.

As shown in FIG. 7, the balanced two-input NAND circuit 700 includes afirst subdeck structure 701 and a second subdeck structure 702 overlyingthe first subdeck structure 701.

The balanced two-input NAND circuit 700 may be similar to the two-inputNAND circuit 400 described above with reference to FIG. 4, except thatthe CMOS circuit 705 includes a single vertical NMOS transistor 710 anda first set of vertical PMOS transistors 720 including multiple (e.g.,more than one) vertical PMOS transistors, and the second CMOS circuit715 may include a single vertical NMOS transistor 711 and a second setof vertical PMOS transistors 750 including multiple (e.g., more thanone) vertical PMOS transistors 750. In some embodiments, the CMOScircuit 705 includes one vertical NMOS transistor 710 and three verticalPMOS transistors 720 and the CMOS circuit 715 includes one vertical NMOStransistor 711 and three vertical PMOS transistors 750. In additionalembodiments, the CMOS circuit 705 includes a different number ofvertical PMOS transistors 720 and/or the CMOS circuit 715 includes adifferent number of additional PMOS transistors 750. For example, theCMOS circuit 705 may include one vertical NMOS transistor 710 and two(2) vertical PMOS transistors 720, and/or the CMOS circuit 715 mayinclude one vertical NMOS transistor 711 and two (2) vertical PMOStransistors 750.

The vertical NMOS transistor 710 of the CMOS circuit 705 includes anN-type source region 710 a, an N-type drain region 710 c, and a P-typechannel region 710 b between the N-type source region 710 a and theN-type drain region 710 c. In addition, each of the vertical PMOStransistors 720 of the CMOS circuit 705 includes a P-type source region720 a, a P-type drain region 720 c, and an N-type channel region 720 bbetween the P-type source region 720 a and the P-type drain region 720c.

The vertical NMOS transistor 711 of the CMOS circuit 715 includes anN-type source region 711 a, an N-type drain region 711 c, and a P-typechannel region 711 b between the N-type source region 711 a and theN-type drain region 711 c. In addition, each of the vertical PMOStransistors 750 of the CMOS circuit 715 includes a P-type source region750 a, a P-type drain region 750 c, and an N-type channel region 750 bbetween the P-type source region 750 a and the P-type drain region 750c.

The vertical NMOS transistor 710 may further include a gate electrode718 disposed around at least sides of the P-type channel region 710 b.The vertical NMOS transistor 711 may further include a gate electrode717 disposed around at least sides of the P-type channel region 711 b.

A gate electrode 728 may extend along and be disposed around at leastsides of the N-type channel region 720 b of each of the vertical PMOStransistors 720. The gate electrode 728 may be shared between each ofthe vertical PMOS transistors 720. Similarly, a gate electrode 758 mayextend along and be disposed around at least sides of the N-type channelregion 750 b of each of the vertical PMOS transistors 750 and may beshared between each of the vertical PMOS transistors 750.

The vertical NMOS transistor 710 may be in electrical communication withthe GND structure 714 through a source contact 712. The vertical NMOStransistor 710 may further be in electrical communication with theinterconnect structure 707 through a drain contact 716. The interconnectstructure 707 may be in electrical communication with the vertical NMOStransistor 711 of the CMOS circuit 715 through a source contact (notshown in the view illustrated in FIG. 7) electrically connected to theN-type source region 711 a.

The vertical NMOS transistor 711 may be in electrical communication withthe output structure 703 through a drain contact 760. The outputstructure 703 may further be in electrical communication with each ofthe vertical PMOS transistors 720 and the vertical PMOS transistors 750through respective drain contacts 726, 756 electrically connected to theP-type drain regions 720 c, 750 c of the respective vertical PMOStransistors 720 and the vertical PMOS transistors 750. Each of the draincontacts 760, 726, 756 may comprise an electrically conductive material.

The vertical PMOS transistors 720 and the vertical PMOS transistors 750may be in electrical communication with the V_(DD) structure 724 throughrespective source contacts 722 electrically coupled to the P-type sourceregion 720 a of each of the vertical PMOS transistors 720 and throughrespective source contacts 752 electrically coupled to the P-type sourceregion 750 a of each of the vertical PMOS transistors 750. Each of thesource contacts 722, 752 may comprise an electrically conductivematerial.

The gate electrode 728 of the vertical PMOS transistors 720 may be inelectrical communication with the first input structure 770 through agate contact 776 comprising an electrically conductive material. Thegate electrode 728 may further be in electrical communication with thegate electrode 718 of the vertical NMOS transistor 710 through a gatecontact 740 comprising an electrically conductive material.

The gate electrode 758 of the vertical PMOS transistors 750 may be inelectrical communication with the second input structure 772 through agate contact 776 comprising an electrically conductive material. Thegate electrode 758 may further be in electrical communication with thegate electrode 717 of the vertical NMOS transistors 711 via a gatecontact comprising an electrically conductive material 778 extendingbetween the gate electrode 758 and the gate electrode 717.

The GND structure 714, the V_(DD) structure 724, the interconnectstructure 707, the output structure 703, the first input structure 770,and the second input structure 772 of the balanced two-input NANDcircuit 700 may exhibit conventional configurations (e.g., conventionaldimensions, conventional shapes, conventional conductive materialcompositions, conventional material distributions, conventionalorientations, conventional arrangements), which are not described indetail herein. Each of the GND structure 714, the V_(DD) structure 724,the interconnect structure 707, the output structure 703, the firstinput structure 770, and the second input structure 772 may comprise asuitable electrically conductive material.

FIG. 8A is a simplified perspective view of a ring oscillator 800, inaccordance with embodiments of the disclosure. The ring oscillator 800may include a first subdeck structure 801 comprising a plurality of NMOStransistors 810 and a second subdeck structure 802 comprising aplurality of PMOS transistors 820 overlying the first subdeck structure801. The ring oscillator 800 includes a GND structure 814, an inputstructure 834, a V_(DD) structure 824, and an output structure 803. Thering oscillator 800 may include adjacent sets of an NMOS transistor 810and a corresponding PMOS transistor 820 overlying the NMOS transistor810.

The first subdeck structure 801 may include a plurality of NMOStransistors 810. Each NMOS transistor 810 may include an N-type sourceregion 810 a, an N-type drain region 810 c, and a P-type channel region810 b between the N-type source region 810 a and the N-type drain region810 c. The N-type source region 810 a may be in electrical communicationwith the GND structure 814 via a source contact 812 comprising anelectrically conductive material. The N-type drain region 810 c may bein electrical communication with the output structure 803 via a draincontact 816 comprising an electrically conductive material.

The PMOS transistors 820 may each comprise a P-type source region 820 a,a P-type drain region 820 c, and an N-type channel region 820 b betweenthe P-type source region 820 a and the P-type drain region 820 c. TheP-type drain region 820 c may be in electrical communication with theoutput structure 803 through a drain contact 826. The P-type sourceregion 820 a may be in electrical communication with the V_(DD)structure 824 via a source contact 822.

The NMOS transistors 810 may each include a gate electrode 818 disposedaround at least sidewalls of the P-type channel region 810 b. Althoughnot illustrated for clarity, a gate dielectric material may be disposedbetween the each gate electrode 818 and each respective vertical NMOStransistor 810. The PMOS transistors 820 may each include a gateelectrode 828 disposed around at least sidewalls of the N-type channelregion 820 b. Although not illustrated for clarity, a gate dielectricmaterial may be disposed between the each gate electrode 828 and eachrespective vertical PMOS transistor 820.

The gate electrode 828 of each vertical PMOS transistor 820 may be inelectrical communication with the input structure 834 through a gatecontact 840 comprising an electrically conductive material. The outputstructure 803 of one set of a vertical NMOS transistor 810 and avertical PMOS transistor 820 may be in electrical communication with aninput structure 834 of an adjacent set of a vertical NMOS transistor 810and a vertical PMOS transistor 820 through a contact structure 842.

The gate electrode 828 of each vertical PMOS transistor 820 may be inelectrical communication with a gate electrode 818 of a respectivevertical NMOS transistor 810 through a gate contact structure (notillustrated in the view of FIG. 8A).

FIG. 8B is a simplified perspective view of another embodiment of a ringoscillator 800′, in accordance with embodiments of the disclosure. Thering oscillator 800′ may include a greater density of vertical NMOStransistors 810 and vertical PMOS transistors 820 than the ringoscillator 800. The ring oscillator 800′ may include adjacent sets of anNMOS transistor 810 and a corresponding PMOS transistor 820. The outputstructure 803 of a first set of an NMOS transistor 810 and acorresponding PMOS transistor 820 may be in electrical communicationwith the gate electrode 818 of an adjacent, second set of an NMOStransistor 810 and PMOS transistor 820 through a gate contact 840. Theoutput structure 803 from the second set may be in electricalcommunication with the gate electrode 818 of an adjacent third set of anNMOS transistor 810 and an associated PMOS transistor 820 through a gatecontact 845 located on an opposite side of the vertical NMOS transistors810 and the vertical PMOS transistors 820 than the gate contact 840.Accordingly, about one-half of the gate contacts (e.g., the gatecontacts) 840 electrically connecting the gate electrodes 818, 828 ofadjacent sets of the NMOS transistors 810 and the PMOS transistors 820may be located on a first side of the gate electrodes 818, 828 and aboutone-half of the gate contacts (e.g., the gate contacts 845) electricallyconnecting the gate electrodes 818, 828 of adjacent sets of the NMOStransistors 810 and the PMOS transistors 820 may be located on a secondside of the gate electrodes 818, 828.

Accordingly, the output structure 803 of each set of the vertical NMOStransistor 810 and the vertical PMOS transistor 820 and associated gatecontacts 840, 845 may alternate between a first side and a second sideof the ring oscillator 800′.

Although FIG. 3 through FIG. 8B have been illustrated as including afirst subdeck structure comprising an array of vertical NMOS transistorsor vertical PMOS transistors and a second subdeck structure comprisingan array of the other of vertical NMOS transistors or vertical PMOStransistors over the first subdeck structure, the disclosure is not solimited. In other embodiments, one or both of the first subdeckstructure and the second subdeck structure may include an array ofplanar NMOS transistors and/or an array of planar PMOS transistors.

Referring to FIG. 9, a balanced two-input NAND circuit 900 comprisingNMOS transistors and PMOS transistors with a planar channel region, inaccordance with embodiments of the disclosure is described. The balancedtwo-input NAND circuit 900 includes a GND structure 914, a V_(DD)structure 924, an output structure 903, a first input structure 970, anda second input structure 974.

As shown in FIG. 9, the balanced two-input NAND circuit 900 includes afirst subdeck structure 901 and a second subdeck structure 902 overlyingthe first subdeck structure 901.

The balanced two-input NAND circuit 900 may include a first CMOS circuitcomprising a planar NMOS transistor 910 in electrical communication withmultiple (e.g., more than one) planar PMOS transistors 920. A secondCMOS circuit of the balanced two-input NAND circuit 900 may comprise aplanar NMOS transistor 911 in electrical communication with multiple(e.g., more than one) planar PMOS transistors 950. In some embodiments,the first CMOS circuit includes one planar NMOS transistor 910 and threeplanar PMOS transistors 920 and the second CMOS circuit includes oneplanar NMOS transistor 911 and three planar PMOS transistors 950. Inadditional embodiments, the first CMOS circuit and/or the second CMOScircuit each include a different number of respective planar PMOStransistors 920 and planar PMOS transistors 950. For example, the firstCMOS circuit and/or the second CMOS circuit may include two planar PMOStransistors 920 and two planar PMOS transistors 950, respectively.

The planar NMOS transistor 910 includes an N-type source region 910 a,an N-type drain region 910 c, and a P-type channel region 910 b betweenthe N-type source region 910 a and the N-type drain region 910 c. Eachof the planar PMOS transistors 920 includes a P-type source region 920a, a P-type drain region 920 c, and an N-type channel region 920 bbetween the P-type source region 920 a and the P-type drain region 920c. Portions of the P-type source region 920 a, the P-type drain region920 c, and the N-type channel region 920 b under the second inputstructure 974 in the view of FIG. 9 are shown in broken lines.

The planar NMOS transistor 911 includes an N-type source region 911 a,an N-type drain region 911 c, and a P-type channel region 911 b betweenthe N-type source region 911 a and the N-type drain region 911 c. Eachof the planar PMOS transistors 950 includes a P-type source region 950a, a P-type drain region 950 c, and an N-type channel region 950 bbetween the P-type source region 950 a and the P-type drain region 950c. Portions of the P-type source region 950 a, the P-type drain region950 c, and the N-type channel region 950 b under the second inputstructure 974 in the view of FIG. 9 are shown in broken lines.

The planar NMOS transistor 910 includes a gate electrode 918 disposedover the P-type channel region 910 b. In the view illustrated in FIG. 9,the gate electrode 918 overlies the P-type channel region 910 b and theassociated planar NMOS transistor 910 may be referred to as a so-called“top gate” transistor. In other embodiments, the gate electrode 918 mayunderlie the P-type channel region 910 b and the planar NMOS transistor910 may be referred to as a so-called “bottom-gate” transistor. In yetother embodiments, the planar NMOS transistor 910 may include a gateelectrode over the P-type channel region 910 b and under the P-typechannel region 910 b and may comprise, for example, a double gatetransistor. In further embodiments, the NMOS transistor 910 may includea gate electrode 918 disposed on one or more sides of the P-type channelregion 910 b.

The planar NMOS transistor 911 may include a gate electrode 917overlying the P-type channel region 911 b. In other embodiments, theplanar NMOS transistor 911 includes a gate electrode underlying theP-type channel region 911 b, a gate electrode overlying and a gateelectrode underlying the P-type channel region 911 b, or a gateelectrode on one or more sides of the P-type channel region 911 b.

A gate electrode 928 may be disposed over the N-type channel region 920b of each of the planar PMOS transistors 920. The gate electrode 928 maybe shared between the set of planar PMOS transistors 920. Similarly, agate electrode 958 may be disposed over the N-type channel region 950 bof each of the planar PMOS transistors 950 and the gate electrode 958may be shared between the set of planar PMOS transistors 950. Asdescribed above with reference to the gate electrodes 917, 918, the gateelectrodes 928, 958 may overlie the respective N-type channel regions920 b, 950 b or may underlie the respective N-type channel regions 920b, 950 b. In other embodiments, the planar PMOS transistors 920 and theplanar PMOS transistors 950 may each include a gate electrode above therespective N-type channel regions 920 b, 950 b and below the respectiveN-type channel regions 920 b, 950 b. In yet other embodiments, each ofthe planar PMOS transistors 920 and the planar PMOS transistors 950 mayeach include a gate electrode on one or more sides of the respectiveN-type channel regions 920 b, 950 b.

The planar NMOS transistor 911 may be in electrical communication withthe GND structure 914 through a source contact 913, which may comprisean electrically conductive material. The planar NMOS transistor 911 mayfurther be in electrical communication with the planar NMOS transistor910 through the N-type source region 911 a, which may be in electricalcommunication with the N-type drain region 910 c of the planar NMOStransistor 910.

The planar NMOS transistor 910 may be in electrical communication withthe output structure 903 through a drain contact 960. The outputstructure 903 may further be in electrical communication with each ofthe planar PMOS transistors 920 and the planar PMOS transistors 950through drain contacts 956, which may be electrically coupled to theP-type drain regions 920 c, 950 c of the respective planar PMOStransistors 920 and the planar PMOS transistors 950. Each of the draincontacts 956, 960 may comprise an electrically conductive material.

The planar PMOS transistors 920 and the planar PMOS transistors 950 maybe in electrical communication with the V_(DD) structure 924 throughrespective source contacts 922 electrically coupled to the P-type sourceregion 920 a of each of the planar PMOS transistors 920 and throughrespective source contacts 952 electrically coupled to the P-type sourceregions 950 a of each of the planar PMOS transistors 950. Each of thesource contacts 922, 952 may comprise an electrically conductivematerial.

The gate electrode 928 of the planar PMOS transistors 920 may be inelectrical communication with the first input structure 970 through agate contact 972. An electrically conductive interconnect structure 941may be in electrical communication with gate electrode 928 through agate contact 943. The electrically conductive interconnect structure 941may be in electrical communication with the gate electrode 918 of theplanar NMOS transistor 910 through a gate contact 940 electricallycoupled to the electrically conductive interconnect structure 941 andthe gate electrode 918.

The gate electrode 958 of the planar PMOS transistors 950 may be inelectrical communication with the second input structure 974 through agate contact 976. The gate electrode 958 may further be in electricalcommunication with the gate electrode 917 of the planar NMOS transistor911 through a gate contact 980 in electrical communication with the gateelectrode 958 and an electrically conductive interconnect structure 979,which is in turn in electrical communication with a gate contact 978 inelectrical communication with the gate electrode 917.

The GND structure 914, the V_(DD) structure 924, the output structure903, the first input structure 970, and the second input structure 974of the balanced two-input NAND circuit 900 may exhibit conventionalconfigurations (e.g., conventional dimensions, conventional shapes,conventional conductive material compositions, conventional materialdistributions, conventional orientations, conventional arrangements),which are not described in detail herein. Each of the GND structure 914,the V_(DD) structure 924, the output structure 903, the first inputstructure 970, and the second input structure 974 of the balancedtwo-input NAND circuit 900 may comprise a suitable electricallyconductive material.

Although FIG. 9 illustrates that the second subdeck structure 902including the lateral PMOS transistors overlying the first subdeckstructure 901 including the lateral NMOS transistors 910, the disclosureis not so limited. In other embodiments, the array of lateral NMOStransistors 910 may overlie the array of lateral PMOS transistors 920.

Although the NMOS transistors and the PMOS transistors of FIG. 3Athrough FIG. 9 have been described and illustrated as comprising avertical channel region or a horizontal channel region and having aparticular orientation, the disclosure is not so limited. In otherembodiments, each of the NMOS transistors and the PMOS transistors maycomprise any transistor structure known in the art, such as, forexample, bottom gate transistors, top gate transistors, double gatetransistors, gate all around (GAA) transistors, single gate transistors,transistors including saddle-shaped channel regions, or other transistorstructures.

Accordingly, in at least some embodiments, a semiconductor devicecomprises a stack structure comprising decks, each deck of the stackstructure comprising a memory element level comprising memory elements,and a control logic level in electrical communication with the memoryelement level, the control logic level comprising a first subdeckstructure comprising a first number of transistors comprising a P-typechannel region or an N-type channel region and a second subdeckstructure comprising a second number of transistors comprising the otherof the P-type channel region and the N-type channel region overlying thefirst subdeck structure.

Accordingly, in some embodiments, a semiconductor device comprises astack structure comprising multiple decks. Each deck of the stackstructure comprises a memory element level comprising memory elements,an access device level comprising access devices electrically connectedto the memory elements of the memory element level, and a control logiclevel. The control logic level comprises a first subdeck structurecomprising a first number of transistors, each transistor of the firstnumber of transistors comprising one of an N-type channel region or aP-type channel region, and a second subdeck structure over the firstsubdeck structure and comprising a second number of transistors, eachtransistor of the second number of transistors comprising the other ofthe N-type channel region or the P-type channel region.

Accordingly, in some embodiments, a semiconductor device comprises afirst deck structure comprising a first memory element level, a firstaccess device level, and a first control logic level, and a second deckstructure over the first deck structure, the second deck structurecomprising a second memory element level, a second access device level,and a second control logic level, wherein at least one of the firstcontrol logic level and the second control logic level comprises atleast one CMOS device in electrical communication with a base controllogic structure.

Referring to FIG. 10A through FIG. 10Z, a method of forming a TFTcontrol logic level (e.g., the TFT control logic level 106A, 108A, 110Aof FIG. 1) is described. In particular, FIG. 10A through FIG. 10Zillustrate a method of forming a TFT control logic level including afirst subdeck structure comprising one of vertical NMOS transistors andPMOS transistors, and a second subdeck structure comprising the other ofthe vertical NMOS transistors and the vertical PMOS transistors over thefirst deck structure.

Referring to FIG. 10A, a semiconductor device 1000 including aconductive material 1014 may be formed over a substrate 1005. Theconductive material 1014 may comprise a suitable electrically conductivematerial for forming, for example, a ground structure. By way ofnonlimiting example, the conductive material 1014 may include metal(e.g., tungsten, titanium, nickel, platinum, aluminum, copper,ruthenium, molybdenum, gold), a metal alloy, a metal-containing material(e.g., metal nitrides, metal silicides, metal carbides, metal oxides), aconductively-doped semiconductor material (e.g., conductively-dopedsilicon, conductively-doped germanium, conductively-doped silicongermanium, etc.), or combinations thereof.

An N-type source material 1010 a may be formed over the conductivematerial 1014, a P-type channel material 1010 b may be formed over theN-type source material 1010 a, and an N-type drain material 1010 c maybe formed over the P-type channel material 1010 b. The N-type sourcematerial 1010 a and the N-type drain material 1010 c may include atleast one N-type conductivity material. By way of nonlimiting example,the N-type source material 1010 a and the N-type drain material 1010 cmay each comprise polysilicon doped with at least one N-type dopant,such as arsenic ions, phosphorous ions, antimony ions, and combinationsthereof. The P-type channel material 1010 b may include at least oneP-type conductivity material. For example, the P-type channel material1010 b may include polysilicon doped with at least one P-type dopant,such as boron ions.

A sacrificial material 1019 may be formed over the N-type drain material1010 c. The sacrificial material 1019 may comprise, for example, silicondioxide, silicon nitride, a polymer, another material, or combinationsthereof. Although FIG. 10A has been described as including forming asacrificial material 1019 over the N-type drain material 1010 c, inother embodiments, the sacrificial material 1019 may not be formed overthe N-type drain material 1010 c and a conductive drain contact materialmay be formed over the N-type drain material.

FIG. 10B is a cross-sectional view of the semiconductor device 1000taken along section line B-B of FIG. 10A. With reference to FIG. 10B,each of the conductive material 1014, the N-type source material 1010 a,the P-type channel material 1010 b, the N-type drain material 1010 c,and the sacrificial material 1019 may be patterned to form an arrayregion of NMOS structures comprising lines of vertical NMOS transistorstructures 1010 extending in the x-direction. In some embodiments, thesubstrate 1005 may be exposed between adjacent lines of the verticalNMOS transistor structures 1010.

Referring to FIG. 10C, a liner material 1013 may be formed conformallyover the NMOS transistor structures 1010 (FIG. 10B). The liner material1013 may comprise, for example, silicon nitride, a silicon oxynitride,silicon dioxide, or another liner material. After forming the linermaterial 1013, a dielectric material 1042 may be formed in spacesbetween adjacent lines of the vertical NMOS transistor structures 1010.The dielectric material 1042 may be planarized, such as by chemicalmechanical polishing (CMP) to remove the dielectric material 1042 fromsurfaces of the sacrificial material 1019. The dielectric material 1042may comprise, for example, silicon dioxide, silicon nitride,phosphosilicate glass, borosilicate glass, borophosphosilicate glass,another electrically insulative material, or combinations thereof.Although FIG. 10C illustrates a dielectric material 1042 between thelines of the NMOS transistor structures 1010, the disclosure is not solimited. In other embodiments, spaces between adjacent lines of the NMOStransistor structures 1010 may include an air gap.

FIG. 10D is a cross-sectional view of the semiconductor device 1000taken along section line D-D of FIG. 10C. After forming the dielectricmaterial 1042, the lines of the vertical NMOS transistor structures 1010may be patterned in the x-direction to form rows and columns of discretevertical NMOS transistor structures extending in the x-direction and they-direction. By way of nonlimiting example, each of the sacrificialmaterial 1019, the N-type drain material 1010 c, the P-type channelmaterial 1010 b, and the N-type source material 1010 a may be patteredto form the discrete vertical NMOS transistor structures 1010. In someembodiments, the conductive material 1014 may remain exposed between theadjacent vertical NMOS transistor structures 1010.

Although FIG. 10D illustrates that substantially all of the N-typesource material 1010 a is removed from surfaces of the conductivematerial 1014 between adjacent vertical NMOS transistor structures 1010,the disclosure is not so limited. In other embodiments, at least aportion of the N-type source material 1010 a remains between adjacentvertical NMOS transistor structures 1010.

Referring to FIG. 10E and FIG. 10F, a gate dielectric material 1017 anda gate electrode material 1018 may be formed over the semiconductordevice 1000. The gate dielectric material 1017 may include any of thematerials described above with reference to the gate dielectric material317 (FIG. 3A through FIG. 3C). By way of nonlimiting example, the gatedielectric material 1017 may include phosphosilicate glass, borosilicateglass, borophosphosilicate glass, fluorosilicate glass, silicon dioxide,titanium dioxide, zirconium dioxide, hafnium dioxide, tantalum oxide,magnesium oxide, aluminum oxide, niobium oxide, molybdenum oxide,strontium oxide, barium oxide, yttrium oxide, a nitride material, (e.g.,silicon nitride (Si₃N₄)), an oxynitride (e.g., silicon oxynitride,another gate dielectric material, or combinations thereof.

The gate electrode material 1018 may include any of the materialsdescribed above with reference to the gate electrode 318 (FIG. 3Athrough FIG. 3C). By way of nonlimiting example, the gate electrodematerial 1018 may include an electrically conductive material including,but not limited to, a metal (e.g., tungsten, titanium, nickel, platinum,aluminum, copper, ruthenium, molybdenum, gold), a metal alloy, ametal-containing material (e.g., metal nitrides, metal silicides, metalcarbides, metal oxides), a conductively-doped semiconductor material(e.g., conductively-doped silicon, conductively-doped germanium,conductively-doped silicon germanium, etc.), or combinations thereof.

After forming the gate electrode material 1018 over the gate dielectricmaterial 1017, the gate electrode material 1018 may be patterned to formdistinct gate electrode structures on sides of each of the vertical NMOStransistor structures 1010. By way of nonlimiting example, the gateelectrode material 1018 may be patterned by exposing the gate electrodematerial 1018 to an anisotropic etch process, such as a reactive ionetch (RIE) process. Methods of anisotropically etching are known in theart and are, therefore, not described in detail herein.

With reference to FIG. 10F, the gate electrode material 1018 may extendlaterally beyond (e.g., in the y-direction) the array of the verticalNMOS transistor structures 1010. As will be described herein, one ormore gate contacts may be formed to electrically connect the gateelectrode material 1018 to one or more other conductive structures atsuch regions of the gate electrode material 1018. The gate electrodematerial 1018 is illustrated in FIG. 10F in broken lines to show thatthe gate electrode material 1018 is behind the vertical NMOS transistorstructures 1010 in the view of FIG. 10F.

Although FIG. 10E and FIG. 10F illustrate that the gate electrodematerial 1018 extends vertically over sidewalls of the N-type sourcematerial 1010 a and the N-type drain material 1010 c, the disclosure isnot so limited. In other embodiments, the gate electrode material 1018may not extend over one or both of sidewalls of the N-type sourcematerial 1010 a and the N-type drain material 1010 c. In someembodiments, the gate electrode material 1018 may extend in a verticaldirection over only a portion of the sidewalls of the P-type channelmaterial 1010 b. In some such embodiments, the gate electrode material1018 may be said to underlap the N-type source material 1010 a and theN-type drain material 1010 c.

Referring to FIG. 10G, a liner material 1032 may be formed over the gateelectrode material 1018 and over sides of the gate dielectric material1017. The liner material 1032 may include, for example, silicon nitride,silicon dioxide, a silicon oxynitride, another liner material, andcombinations thereof. After forming the liner material 1032, adielectric material 1043 may be formed over the liner material 1032 inbetween adjacent vertical NMOS transistor structures 1010. Thedielectric material 1043 may include silicon dioxide, silicon nitride,phosphosilicate glass, borosilicate glass, borophosphosilicate glass,another electrically insulative material, or combinations thereof. Thedielectric material 1043 may be planarized and removed from a topsurface of the sacrificial material 1019. The top exposed surface of thedielectric material 1043 may be substantially planar with the topexposed surface of the sacrificial material 1019.

With continued reference to FIG. 10G, in some embodiments, thesacrificial material 1019 may be removed from at least some of thevertical NMOS transistor structures 1010 (e.g., from the N-type drainmaterial 1010 c of at least some of the vertical NMOS transistorstructures 1010). By way of nonlimiting example, the sacrificialmaterial 1019 may be removed by exposing the sacrificial material 1019to a wet etchant, a dry etchant, or a combination thereof. After thesacrificial material 1019 is removed, a drain contact material 1016 maybe formed over the N-type drain material 1010 c of each of the verticalNMOS transistor structures 1010. The drain contact material 1016 may beplanarized such that a top surface of the drain contact material 1016 issubstantially planar with a top surface of the dielectric material 1043.

In some embodiments, the sacrificial material 1019 may not be removedfrom surfaces of at least some of the vertical NMOS transistorstructures 1010. In some such embodiments, the vertical NMOS transistorstructures 1010 on which the sacrificial material 1019 remains may notbe electrically coupled to other regions of the semiconductor device andmay comprise, for example, dummy NMOS transistors. Accordingly,depending on a desired circuit configuration, the sacrificial material1019 may not be removed from at least some of the vertical NMOStransistor structures 1010.

Although FIG. 10G illustrates that the sacrificial material 1019 isremoved from only some of the vertical NMOS transistor structures 1010,the disclosure is not so limited. In other embodiments, the sacrificialmaterial 1019 may be removed from over the N-type drain material 1010 cof substantially all of the vertical NMOS transistor structures 1010 andthe drain contact material 1016 may be formed over the N-type drainmaterial 1010 c of substantially all of the vertical NMOS transistorstructures 1010.

Although FIG. 10A through FIG. 10G have been described as including thesacrificial material 1019 over the vertical NMOS transistor structures1010, the disclosure is not so limited. In other embodiments, thesacrificial material 1019 may not be formed over the N-type drainmaterial 1010 c as described above with reference to FIG. 10A. In somesuch embodiments, the drain contact material 1016 may be formed directlyover the N-type drain material 1010 c prior to patterning the verticalNMOS transistor structures 1010. The drain contact material 1016 may beformed over vertical NMOS transistor structures 1010 which are desiredto be coupled to other regions of the semiconductor device.

Referring to FIG. 10H and FIG. 10I, a conductive material may be formedover the semiconductor device 1000 and patterned to form conductivelines 1003. The conductive lines 1003 may include the same material asdescribed above with reference to the conductive material 1014. Theconductive lines 1003 may be patterned such that the conductive lines1003 extend in the y-direction. In some embodiments, the conductivelines 1003 may extend in the same direction as the conductive lines ofthe conductive material 1014.

Referring to FIG. 10J, conductive contacts 1026 may be formed over oneor more of the vertical NMOS transistor structures 1010 to electricallycouple the respective vertical NMOS transistor structures 1010 to theconductive line 1003. In some embodiments, the conductive contacts 1026are not formed over all of the vertical NMOS transistor structures 1010such that a later formed transistor structure is not electricallyconnected to the conductive line 1003, depending on a circuit layout anddesign of the semiconductor device 1000.

A dielectric material 1025 may be formed between the conductive contacts1026. The dielectric material 1025 may comprise a suitable electricallyinsulative material, such as, for example, silicon dioxide, siliconnitride, phosphosilicate glass, borosilicate glass, borophosphosilicateglass, another electrically insulative material, or combinationsthereof. The dielectric material 1025 may comprise the same material asthe dielectric material 1042.

FIG. 10K is a cross-sectional view of the semiconductor device of FIG.10J taken along section line K-K of FIG. 10J. In some embodiments, agate contact 1040 may be formed at peripheral portions of thesemiconductor device to form an electrical connection between the gateelectrode material 1018 and at least one of a word line driver andanother gate electrode material, as will be described herein. In someembodiments, and as will be described herein, at least some of the gatecontacts 1040 may be configured to electrically coupled at least some ofthe gate electrode materials 1018 to a gate electrode materialassociated with an associated vertical PMOS transistor structure.

Referring to FIG. 10L, a second subdeck structure 1002 may be formedover the conductive lines 1003. The second subdeck structure 1002 mayinclude a P-type drain material 1020 c over the conductive contacts 1026and the dielectric material 1025, an N-type channel material 1020 b overthe P-type drain material 1020 c, a P-type source material 1020 a overthe N-type channel material 1020 b, and a sacrificial material 1029 overthe P-type source material 1020 a. Each of the P-type drain material1020 c and the P-type source material 1020 a may include at least oneP-type conductivity material and may comprise, for example, polysilicondoped with at least one P-type dopant, such as boron ions. The N-typechannel material 1020 b may include a material similar to the N-typesource material 1010 a and the N-type drain material 1010 c, such as,for example, polysilicon doped with at least one N-type dopant, such asarsenic ions, phosphorous ions, antimony ions, and combinations thereof.The sacrificial material 1029 may include one or more of the materialsdescribed above with reference to the sacrificial material 1019.

Referring to FIG. 10M, the sacrificial material 1029, the P-type sourcematerial 1020 a, the N-type channel material 1020 b, and the P-typedrain material 1020 c may be patterned in the y-direction to form linesof vertical PMOS transistor structures 1020 extending in the x-direction(into the page in the view of FIG. 10M) in an array region of the secondsubdeck structure 1002. After forming the lines of the vertical PMOStransistor structures 1020 in the array region, a liner material 1023may be formed (e.g., deposited) over at least sidewalls of the verticalPMOS transistor structures 1020. The liner material 1023 may be removedfrom a top surface of the sacrificial material 1029 and from laterallyextending surfaces extending between adjacent lines of vertical PMOStransistor structures 1020. The liner material 1023 may comprise one ormore of the materials described above with reference to the linermaterial 1013 such as, for example, a silicon nitride material, asilicon oxynitride material, silicon dioxide, another material, orcombinations thereof.

After forming the liner material 1023, a dielectric material 1033 may beformed between adjacent lines of the vertical PMOS transistor structures1020. The dielectric material 1033 may comprise a suitable electricallyinsulative material, such as, for example, silicon dioxide, siliconnitride, phosphosilicate glass, borosilicate glass, borophosphosilicateglass, another electrically insulative material, or combinationsthereof. The dielectric material 1033 may be removed from over surfacesof the sacrificial material 1029 and the dielectric material 1033 may beplanarized, such as by chemical mechanical polishing.

Referring to FIG. 10N, each of the lines of the vertical PMOS transistorstructures 1020 may be patterned in the y-direction by removing portionsof the each of the sacrificial material 1029, the P-type source material1020 a, the N-type channel material 1020 b, and the P-type drainmaterial 1020 c to form an array of isolated vertical PMOS transistorstructures 1020, which may be arranged in rows and columns or in anotherorientation. In some embodiments, removing the portions of the each ofthe sacrificial material 1029, the P-type source material 1020 a, theN-type channel material 1020 b, and the P-type drain material 1020 c mayexpose the dielectric material 1025 between adjacent vertical PMOStransistor structures 1020.

Referring to FIG. 10O and FIG. 10P, a gate dielectric material 1027 maybe formed over the vertical PMOS transistor structures 1020 and a gateelectrode material 1028 may be formed over the gate dielectric material1027. The gate dielectric material 1027 may overlie at least sidewallsof the vertical PMOS transistor structures 1020, such as, at leastsidewalls of the P-type source material 1020 a, the N-type channelmaterial 1020 b, and the P-type drain material 1020 c. The gatedielectric material 1027 may include one or more of the materialsdescribed above with reference to the gate dielectric material 1017. Insome embodiments, the gate dielectric material 1027 comprises the samematerial as the gate dielectric material 1017.

The gate electrode material 1028 may be formed over the gate dielectricmaterial 1027. The gate electrode material 1028 may extend over anentire vertical length (in the z-direction) of the N-type channelmaterial 1020 b and may extend, at least partially, over the P-typesource material 1020 a and the P-type drain material 1020 c. In otherembodiments, the gate electrode material 1028 may not extend over one orboth of the P-type source material 1020 a and the P-type drain material1020 c. In some such embodiments, the gate electrode material 1028 maybe said to underlap the P-type source material 1020 a and the P-typedrain material 1020 c.

Referring to FIG. 10Q, the sacrificial material 1029 (FIG. 10P) may beremoved and replaced with an electrically conductive material 1022. Theelectrically conductive material 1022 may comprise suitable electricallyconductive material for forming a conductive contact, such as, forexample, tungsten, tungsten nitride, titanium, titanium nitride,aluminum, copper, ruthenium, molybdenum, silver, gold, polysilicon,another conductive material, or combinations thereof.

Although FIG. 10Q has been described as including removing thesacrificial material 1029 from over the P-type source material 1020 a ofeach of the vertical PMOS transistor structures 1020, the disclosure isnot so limited. In other embodiments, and depending on a desired circuitconfiguration of the semiconductor device 1000, the sacrificial material1029 may not be removed and may remain on the P-type source material1020 a of at least some of the vertical PMOS transistor structures 1020.In some such embodiments, vertical PMOS transistor structures 1020 onwhich the sacrificial material 1029 remains may be electrically isolatedfrom a later formed conductive line (e.g., a V_(DD) structure).

Although FIG. 10L through FIG. 10P have been described as including thesacrificial material 1029 over the vertical PMOS transistor structures1020, the disclosure is not so limited. In other embodiments, thesacrificial material 1029 may not be formed over the P-type sourcematerial 1020 a as described above with reference to FIG. 10L. In somesuch embodiments, the electrically conductive material 1022 may beformed directly over the P-type source material 1020 a prior topatterning the vertical PMOS transistor structures 1020.

With continued reference to FIG. 10Q, the electrically conductivematerial 1022 may be planarized, such as by chemical mechanicalpolishing. A dielectric material 1042 may be formed over sides of thegate dielectric material 1027 and the dielectric material 1042. Thedielectric material 1042 may comprise one or more of the materialsdescribed above with reference to the liner material 1032.

A dielectric material 1044 may be formed in regions between the adjacentvertical PMOS transistor structures 1020. The dielectric material 1044may include a suitable electrically insulative material and may includeone or more of the materials described above with reference to thedielectric material 1042.

Referring to FIG. 10R, one or more gate contacts 1041, 1045 may beformed. In some embodiments, a gate contact 1041 may be formed inelectrical communication with the gate contact 1040 formed in the firstdeck structure 1001. The gate contacts 1041, 1045 may be formed inperipheral regions of the semiconductor device, such as outside an arrayarea of the vertical PMOS transistor structures 1020. The gate contacts1041, 1045 may include a suitable electrically conductive material andmay include one or more of the materials described above with referenceto the gate contact 1040. In some embodiments, the gate contacts 1041,1045 comprise the same material as the gate contact 1040.

In some embodiments, all of the gate electrode materials 1028 may beelectrically connected to a gate contact 1041, 1045. In otherembodiments, only some of the gate electrode materials 1028 areelectrically connected to a gate contact 1041, 1045. In someembodiments, the gate electrode material 1028 is in electricalcommunication with a gate electrode material from another deck (e.g.,the first deck structure 1001), such as one or more of the gateelectrode materials 1018.

Referring to FIG. 10S and FIG. 10T, a mask 1046 may be formed (e.g.,deposited) over the semiconductor device 1000, such as over theelectrically conductive material 1022 and the dielectric material 1044between adjacent vertical PMOS transistor structures 1020. Withreference to FIG. 10T, openings 1047 may be formed at one or morelocations of the mask 1046. By way of nonlimiting example, at least oneopening 1047 may be formed in the mask 1046 over a gate contact (e.g.,the gate contact 1041) and at least one opening 1047 may be formed overat least one of the vertical PMOS transistor structures 1020.

Referring to FIG. 10U and FIG. 10V, the electrically conductive material1022 exposed through the openings 1047 (FIG. 10T) in the mask 1046 (FIG.10T) may be removed and the mask 1046 may be removed (e.g., stripped)from the semiconductor device 1000. Referring to FIG. 10V, the openings1047 may be filled with a dielectric material 1048, which may comprisean insulative material, such as, for example silicon dioxide.

Referring to FIG. 10W and FIG. 10X, a conductive material may be formedand patterned over the semiconductor device 1000 to form conductivelines 1050 (such as V_(DD) structures). The conductive lines 1050 maycomprise any suitable conductive material, such as, for example,tungsten, tungsten nitride, titanium, titanium nitride, aluminum,copper, ruthenium, molybdenum, silver, gold, polysilicon, anotherconductive material, or combinations thereof.

Since the conductive material 1022 over at least some of the verticalPMOS transistor structures 1020 was removed, at least some of thevertical PMOS transistor structures 1020 may not be electricallyconnected to a respective conductive line 1050. Accordingly, some of thevertical PMOS transistor structures 1020 may be electrically isolatedfrom a respective conductive line 1050 at least through the dielectricmaterial 1048. In other embodiments, and referring back to FIG. 10T),the conductive material 1022 may not be removed from any of the verticalPMOS transistor structures 1020. In some such embodiments, substantiallyall of the vertical PMOS transistor structures 1020 may be in electricalcommunication with the conductive line 1050.

Referring to FIG. 10Y and FIG. 10Z, a dielectric material 1052 may beformed over the semiconductor device 1000 and may fill regions betweenadjacent conductive lines 1050. The dielectric material 1052 may beplanarized, such as by chemical mechanical polishing.

Forming the semiconductor device 1000 to include the NMOS transistorsand the PMOS transistors over the other of the NMOS transistors and thePMOS transistors may facilitate forming the NMOS transistors separatelyfrom the PMOS transistors of a CMOS circuit. In addition, since thesemiconductor structure may include stacked decks over a base controllogic structure, each deck comprising TFT control logic structurecomprising CMOS circuits, an amount of interconnect circuitry (e.g.,conductive sockets, conductive plugs, conductive lines, etc.) from eachdeck structure to the base control logic structure may be reduced.

Accordingly, in some embodiments, a method of forming a semiconductordevice comprises forming deck structures over a substrate, whereinforming deck structures comprises forming each deck structure tocomprise a memory element level and a control logic level. Forming atleast one control logic level of at least one deck structure comprisesforming a first subdeck structure comprising first transistors, at leastsome transistors of the first transistors comprising one of N-typechannel regions or P-type channel regions, forming a second subdeckstructure comprising second transistors over the first subdeckstructure, at least some of the second transistors comprising the otherof the N-type channel regions or the P-type channel regions, andelectrically connecting the at least some transistors of the firsttransistors to the at least some transistors of the second transistorsto form a device.

Although FIG. 3 through FIG. 8B and FIG. 10A through FIG. 10Z have beendescribed and illustrated as including transistor structures comprisinga double gate structure wherein the channel regions of the NMOStransistors and the channel regions of the PMOS transistors include agate on two sides thereof, the disclosure is not so limited. In otherembodiments, the NMOS transistors and the PMOS transistors of asemiconductor device may be arranged as bottom gate transistors, topgate transistors, gate all around (GAA) transistors, saddle gatetransistors, or other transistor structures.

FIG. 11A and FIG. 11B are simplified cross-sectional views of a portionof a TFT control logic level 200 (FIG. 2) including vertical transistorsarranged as single gate transistors. Referring to FIG. 11A, a portion ofa semiconductor device 1100 including a vertical NMOS transistor 1110and a vertical PMOS transistor 1120 over the vertical NMOS transistor1110 is illustrated.

In some embodiments, all of the gate electrode materials 1028 may beelectrically connected to a gate contact 1041, 1045. In otherembodiments, only some of the gate electrode materials 1028 areelectrically connected to a gate contact 1041, 1045. In someembodiments, the gate electrode material 1028 is in electricalcommunication with a gate electrode material from another deck (e.g.,the first deck structure 1001), such as one or more of the gateelectrode materials 1018.

The vertical NMOS transistor 1110 overlies a source contact 1112 and GNDstructure 1114, which may be substantially the same as the sourcecontact 312 and the GND structure 314 described above with reference toFIG. 3A through FIG. 3C. A drain contact 1116 may overlie the N-typedrain region 1110 c of the vertical NMOS transistor 1110. An outputstructure 1103 may overlie the drain contact 1116. A drain contact 1126may overlie the output structure 1103 and may be in electricalcommunication with the P-type drain region 1120 c. The drain contact1116, the drain contact 1126, the output structure 1103 may besubstantially the same as the drain contact 316, the drain contact 326,and the output structure 303, respectively described above withreference to FIG. 3A through FIG. 3C. A source contact 1122 may overlieand be in electrical communication with the P-type source region 1120 aand may comprise substantially the same material described above withrespect to the source contact 322 (FIG. 3A through FIG. 3C).

A gate dielectric material 1117 may overlie sidewalls of at least theP-type channel region 1110 b. In some embodiments, the gate dielectricmaterial 1117 overlies sidewalls of one or more of the N-type sourceregion 1110 a, the N-type drain region 1110 c, and the drain contact1116. The gate dielectric material 1117 may comprise substantially thesame materials described above with respect to the gate dielectricmaterial 317 (FIG. 3A, FIG. 3B).

A gate electrode 1118 may overlie sides of at least a portion of thegate dielectric material 1117. The gate electrode 1118 may comprisesubstantially the same materials described above with respect to thegate electrode 318 (FIG. 3A through FIG. 3C).

A gate dielectric material 1127 may overlie sidewalls of at least theN-type channel region 1120 b. In some embodiments, the gate dielectricmaterial 1127 overlies sidewalls of one or more of the P-type sourceregion 1120 a, the P-type drain region 1120 c, and the source contact1122. The gate dielectric material 1127 may comprise substantially thesame materials described above with respect to the gate dielectricmaterial 1117.

A gate electrode 1128 may overlie at least a portion of the gatedielectric material 1117. The gate electrode 1128 may comprisesubstantially the same materials described above with respect to thegate electrode 1118.

With continued reference to FIG. 11A and FIG. 11B, each of the verticalNMOS transistor 1110 and the vertical PMOS transistor 1120 may include arespective gate electrode 1118, 1128 on only one side thereof. In otherwords, the vertical NMOS transistor 1110 and the vertical PMOStransistor 1120 may comprise a so-called single gate or a gate one sidetransistor. Accordingly, in some embodiments, the devices describedabove with reference to FIG. 3 through FIG. 8B and FIG. 10A through FIG.10Z may include one or more vertical NMOS transistors 1110 and/or one ormore vertical PMOS transistors 1120.

Referring to FIG. 12A and FIG. 12B, a portion of a semiconductor device1200 including a vertical NMOS transistor 1210 and a vertical PMOStransistor 1220 over the vertical NMOS transistor 1210 is illustrated.FIG. 12A and FIG. 12B are cross-sectional views of the semiconductordevice 1200. The semiconductor device 1200 may be substantially the sameas the semiconductor device 1100, except that the semiconductor device1200 may include a vertical NMOS transistor 1210 and a vertical PMOStransistor 1220 including a gate around all sides thereof, as will bedescribed herein.

The vertical NMOS transistor 1210 includes an N-type source region 1210a, a P-type channel region 1210 b over the N-type source region 1210 a,and an N-type drain region 1210 c over the P-type channel region 1210 b.A gate dielectric material 1217 may overlie at least sidewalls of theP-type channel region 1210 b. In some embodiments, the gate dielectricmaterial 1217 overlies sidewalls of one or more of the N-type sourceregion 1210 a, the N-type drain region 1210 c, and the drain contact1116. The gate dielectric material 1127 may comprise substantially thesame materials described above with respect to the gate dielectricmaterial 1117 (FIG. 11A, FIG. 11B).

A gate electrode 1218 may overlie sides of the gate dielectric material1217. The gate electrode 1218 may comprise substantially the samematerials described above with respect to the gate electrode 1118 (FIG.11A, FIG. 11B). With reference to FIG. 12A and FIG. 12B, the gateelectrode 1218 may be located around all sidewalls of the vertical NMOStransistor 1210. In some such embodiments, the vertical NMOS transistor1210 may be referred to as a so-called gate all around (GAA) transistor.

The vertical PMOS transistor 1220 includes a P-type drain region 1220 c,an N-type channel region 1220 b over the P-type drain region 1220 c, anda P-type source region 1220 a over the N-type channel region 1220 b. Agate dielectric material 1227 may overlie at least sidewalls of theN-type channel region 1220 b. In some embodiments, the gate dielectricmaterial 1227 overlies sidewalls of one or more of the P-type sourceregion 1220 a, the P-type drain region 1220 c, and the source contact1122. The gate dielectric material 1227 may include substantially thesame materials described above with reference to the gate dielectricmaterial 1217.

A gate electrode 1228 may overlies sides of the gate dielectric material1227. The gate electrode 1228 may comprise substantially the samematerials described above with respect to the gate electrode 1218. Withreference to FIG. 12A and FIG. 12B, the gate electrode 1228 may belocated around all sidewalls of the vertical PMOS transistor 1220. Insome such embodiments, the vertical PMOS transistor 1220 may comprise aGAA transistor.

Accordingly, in some embodiments, the devices described above withreference to FIG. 3 through FIG. 8B and FIG. 10A through FIG. 10Z mayinclude one or more vertical NMOS transistors 1210 and/or one or morevertical PMOS transistors 1220.

In further embodiments, the devices described above with reference toFIG. 3 through FIG. 10Z may include transistor structures includingso-called saddle channel regions. In some such embodiments, one or moretransistors (e.g., one or more NMOS transistors, one or more PMOStransistors, or a combination thereof) may comprise a transistorincluding a saddle-shaped channel wherein the channel region is shapedand configured such that current flows in both a lateral direction and avertical direction.

Although FIG. 3A through FIG. 12B have been illustrated as includingonly a particular arrangement of NMOS transistors and PMOS transistors,the disclosure is not so limited. In some embodiments, the devices andstructures described above with reference to FIG. 3A through FIG. 12Bmay include one or more NMOS transistors and/or one or more PMOStransistors that are in electrical communication with CMOS devices thatare not illustrated. In some embodiments, the devices and structuresdescribed above with reference to FIG. 3A through FIG. 12B may includeone or more NMOS transistors and/or one or more PMOS transistors thatare not in electrical communication with any other devices.

Semiconductor devices (e.g., the semiconductor devices 100, 1000, 1100,1200) including semiconductor device structures and circuits (e.g., thecircuits, structures, and devices described above with reference to FIG.3A through FIG. 9) in accordance with embodiments of the disclosure maybe used in embodiments of electronic systems of the disclosure. Forexample, FIG. 13 is a block diagram of an illustrative electronic system1300 according to embodiments of disclosure. The electronic system 1300may comprise, for example, a computer or computer hardware component, aserver or other networking hardware component, a cellular telephone, adigital camera, a personal digital assistant (PDA), portable media(e.g., music) player, a WiFi or cellular-enabled tablet such as, forexample, an iPad® or SURFACE® tablet, an electronic book, a navigationdevice, etc. The electronic system 1300 includes at least one memorydevice 1302. The at least one memory device 1302 may include, forexample, an embodiment of the semiconductor device 100 previouslydescribed with respect to FIG. 1. The electronic system 1300 may furtherinclude at least one electronic signal processor device 1304 (oftenreferred to as a “microprocessor”). The electronic signal processordevice 1304 may, optionally, include a semiconductor device structuresimilar to an embodiment of the semiconductor device 100 previouslydescribed with respect to FIG. 1. The electronic system 1300 may furtherinclude one or more input devices 1306 for inputting information intothe electronic system 1300 by a user, such as, for example, a mouse orother pointing device, a keyboard, a touchpad, a button, or a controlpanel. The electronic system 1300 may further include one or more outputdevices 1308 for outputting information (e.g., visual or audio output)to a user such as, for example, a monitor, a display, a printer, anaudio output jack, a speaker, etc. In some embodiments, the input device1306 and the output device 1308 may comprise a single touch screendevice that can be used both to input information to the electronicsystem 1300 and to output visual information to a user. The one or moreinput devices 1306 and output devices 1308 may communicate electricallywith at least one of the memory device 1302 and the electronic signalprocessor device 1304.

While certain illustrative embodiments have been described in connectionwith the figures, those of ordinary skill in the art will recognize andappreciate that embodiments encompassed by the disclosure are notlimited to those embodiments explicitly shown and described herein.Rather, many additions, deletions, and modifications to the embodimentsdescribed herein may be made without departing from the scope ofembodiments encompassed by the disclosure, such as those hereinafterclaimed, including legal equivalents. In addition, features from onedisclosed embodiment may be combined with features of another disclosedembodiment while still being encompassed within the scope of thedisclosure.

What is claimed is:
 1. A device, comprising: a first deck structurecomprising: a first memory element level; and a first control logiclevel vertically neighboring the first memory element level andincluding a first column decoder comprising a first group of transistorsvertically neighboring a second group of transistors, gate electrodes ofthe first group of transistors vertically displaced from gate electrodesof the second group of transistors; and a second deck structurevertically neighboring the first deck structure and comprising: a secondmemory element level; and a second control logic level including asecond column decoder, the second control logic level including at leastone device in operable communication with an off-deck device external tothe second deck structure.
 2. The device of claim 1, wherein theoff-deck device comprises a base control logic structure.
 3. The deviceof claim 2, wherein the base control logic structure comprises one ormore of charge pumps, delay-locked loop circuitry, and drain supplyvoltage regulators.
 4. The device of claim 2, wherein the base controllogic structure is shared by the first deck structure and the seconddeck structure.
 5. The device of claim 1, wherein: the first deckstructure further comprises a first access device level verticallyneighboring the first control logic level; and the second deck structurefurther comprises a second access device level vertically neighboringthe second control logic level.
 6. The device of claim 1, wherein: thefirst control logic level comprises a first word line driver operativelycoupled to a first row decoder in the first control logic level; and thesecond control logic level comprises a second word line driveroperatively coupled to a second row decoder in the second control logiclevel.
 7. The device of claim 1, wherein the first control logic levelcomprises at least a first multiplexer and the second control logiclevel comprises at least a second multiplexer.
 8. An electronic system,comprising: an input device; an output device; a processor deviceoperably coupled to the input device and the output device; and a memorydevice operably coupled to the processor device and comprising: a firstdeck comprising: a first memory element level; and a first control logiclevel vertically neighboring the first memory element level andcomprising: a first subdeck structure comprising first verticaltransistors; and a second subdeck structure vertically neighboring thefirst subdeck structure and comprising second vertical transistors inoperable communication with the first vertical transistors, gateelectrodes of the first vertical transistors vertically displaced fromgate electrodes of the second vertical transistors; and a second deckvertically neighboring the first deck, the second deck comprising: asecond memory element level; and a second control logic level verticallyneighboring the second memory element level and comprising: a thirdsubdeck structure comprising third vertical transistors; and a fourthsubdeck structure vertically neighboring the third subdeck structure andcomprising fourth vertical transistors in operable communication withthe third vertical transistors.
 9. The electronic system of claim 8,wherein the first control logic level comprises a first column repairdevice and the second control logic level comprises a second columnrepair device.
 10. The electronic system of claim 8, wherein the firstsubdeck structure and the second subdeck structure together comprise aCMOS TFT inverter.
 11. The electronic system of claim 8, wherein thefirst vertical transistors are electrically coupled to and associatedwith corresponding second vertical transistors via an output structurevertically between the first subdeck structure and the second subdeckstructure.
 12. The electronic system of claim 8, wherein some of thesecond vertical transistors are in electrical communication with a drainsupply voltage structure within the first deck and others of the secondvertical transistors are electrically isolated from the drain supplyvoltage structure by a dielectric material.
 13. The electronic system ofclaim 8, further comprising a gate contact electrically coupling a firstgate electrode of one of the first vertical transistors to a second gateelectrode of one of the second vertical transistors.
 14. The electronicsystem of claim 8, wherein the first vertical transistors comprise oneof single gate transistors and double gate transistors.
 15. Theelectronic system of claim 8, wherein the first vertical transistorscomprise gate all around transistors.
 16. A method of forming a device,the method comprising: forming a first deck structure comprising a firstcontrol logic level including a first word line driver in electricalcommunication with a first memory element level, the first word linedriver comprising a first group of transistors vertically neighboring asecond group of transistors, gate electrodes of the first group oftransistors vertically displaced from gate electrodes of the secondgroup of transistors, the first control logic level verticallyneighboring the first memory element level; and forming a second deckstructure vertically neighboring the first deck structure, the seconddeck structure comprising a second control logic level including asecond word line driver in electrical communication with a second memoryelement level.
 17. The method of claim 16, wherein: forming a first deckstructure comprises forming the first deck structure to include a firstmultiplexer; and forming a second deck structure comprises forming thesecond deck structure to include a second multiplexer.
 18. The method ofclaim 16, wherein: forming a first deck structure comprises forming thefirst deck structure to comprise a first column decoder; and forming asecond deck structure comprises forming the second deck structure tocomprise a second column decoder.
 19. The method of claim 16, furthercomprising forming a base control logic structure in electricalcommunication with the first deck structure and the second deckstructure.
 20. The device of claim 1, wherein: each transistor of thefirst group of transistors comprises a channel region vertically betweena first source region and a first drain region; and each transistor ofthe second group of transistors comprises a second channel regionvertically between a second source region and a second drain region.